Investigations On The Fabrication Technoloy Of Micro-thermoelectric Power Generators

With the development of semiconductor technology,the miniaturization of electronic devices and miniaturization has becomeing a tendency.The miniaturization of electronic devices need low voltage high power of micro power,the micro-thermoelectric power generators(noted as MTEG)has various advantages.MTEG manufactured with thin-film thermoelectric materials,adopted electrodeposit technology with low cost and easy to realize.This topic designed structure of METG and explored preparation technology of it.On this basis,the method of optimization was applied to the cooling fin structure of the METG through the engineering simulation.A kind of MTEG with longitudinal structure was designed in this article,which is further optimized in structure,which incorporated with n-type and p-type legs and conductive connection to realize high density integrationThis kind of MTEG has characteristics of stronger feasibility,better operability,higher stability,suitable for the establishment of large temperature difference.Graphical process in semiconductor technology can determine the position of the various components of MTEG accurately,can increase density and stability of thermoelectric unit packaging substantially,can improve performance of MTEG significantly.To improve and optimize the preparation process and to reduce production steps this paper study on the influence of various factors on MTEG performance systematically including heating time,number of heating time and packaging conditions.Packaging materials on the heating board was preheat 50 s,to release the exothermic chemical shrinkage stress.This paper optimized the preparation technology of the single cell battery,reduced the production steps.This paper studies technique about MTEG assembly,present solution of four layers as a cycle of the assembly process.Conductive silver pulp daub method is better than that of chemical copper plating method,to solve electrical connection on the side of the battery.Battery assembled by 8 MTEG layer has subminiature size: 36 mm long,2.6 mm high,2 mm thick.Performance test showed that at room temperature and in difference temperature of 20 k,the maximum output power of MTEG is 35.7uW.By means of finite element simulation,in view of the four factors(the bottom width,the thickness of the floor,floor length and thickness of the floor)comprehensive optimum size is determined by means of finite element simulation and changing single factor.It is concluded that the best heat sink size of the bottom width 70 mm,base plate thickness 5 mm,rib 40 mm,rib spacing 2 mm,fin thickness 0.5 mm,edge thickness 2 mm,fin number of 26.