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Numerical Simulation Of Heat Transfer Performance Of Temperature Equalizing Device

Posted on:2018-03-01Degree:MasterType:Thesis
Country:ChinaCandidate:L N HuFull Text:PDF
GTID:2322330512978600Subject:Engineering Thermal Physics
Abstract/Summary:PDF Full Text Request
A new type of temperature equalizing device with natural convection is proposed for certain communication electronic equipments with special requirements in noise control and temperature uniformity.Since the vapor-liquid phase change process is isothermal,two-phase fluid pipelines are set in the temperature equalizing device,through the vapor-liquid phase change of working fluid,heat transfer performance and temperature uniformity is enhanced.Moreover,the perfect uniformity of temperature distribution and no noise of electronic devices are realized.In this paper,we simulate the heat transfer process and analyze the structural strength of the temperature equalizing device.The main contents are as follows:(1)A new flow and heat transfer model is created to simulate the two phase flow,heat transfer and vapor-liquid phase change process in the vapor chamber,also,theoretical analysis is used to investigate the heat transport capability of the vapor chamber.Also,we analyze the influence of filling ratios,working fluid,heat flux,gravity,pipe structure and size to the performance of the vapor chamber.By observing the phase distribution,the local flow field and the temperature field distribution of the working fluid during the operation of the vapor chamber to reveal the thermal control mechanism of the temperature equalizing device with natural convection.(2)The influence of internal vapor pressure and temperature on the strength is taken into account to analyze the structural strength of the vapor chamber by ANSYS,and the stress and deformation distribution of the vapor chamber are achieved.Then we study the stress distribution and structural deformation when using different structures of the vapor chamber.At last,we analyze three structural reinforcement schemes to solve the problem of the high vapor pressure in the vapor chamber.The simulation results show that adding the support column inside the vapor chamber obviously reduce the equivalent stress value and the Z direction deformation quantity.And it is found that when the working fluid R245fa is used,the temperature equalizing device has better heat transfer performance and structural strength.
Keywords/Search Tags:temperature equalizing device, two-phase flow, vapor-liquid phase change, structural strength
PDF Full Text Request
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