Research On Silicon Wafer Production By Automation System Based On PLC

The biggest problem of which the traditional silicon technology produces silicon wafers is expensive,and the process of production is cumbersome.It wastes half of the raw material that the production of wafers required.It often happens that wire is broken to cut the silicon ingot.It is grinded into the dentate and causes more waste,and the traditional technology can only create a specific thickness and size silicon wafer,so it can not meet the specific demand for the new solar wafer now.We study new method for silicon production in which the silicon wafers are dipped.We can produce products of different size and thickness meeting different requirement,and it produces no waste to utilize silicon material.It saves nearly a half of the raw materials.It is greatly improved the economic efficiency with the production rate of seven times.In this paper,we utilize PLC of the Fuji motor to control the mechanical transport system,track system and automatic network monitoring system,and the system of automatic mechanics is orderly and stably controlled to operate with the nonlinear velocity and the accurate position.It completes the automatic procedures set by control the center in all the effective working area.We ensure rail car to naturally run the track,and specifically design the control software with nonlinear variable motion.At present,the process of the control device can automatically start and stop in controlled condition,and the control device in the process can automatically start and stop in controlled condition at present.It automatically adjusts every link of the desired state.We use the way of locking and achieve the purpose of safe operation.The network is the main supporting environment of the automation system,and the rail system with vehicle scheduling and management platform are realized through wireless network,and monitoring state is also realized through the wireless network.New process preheating subsystem in the manufacturing process in the process of silicon film system with silicon wafer annealing subsystem and baked detection subsystem,new manufacturing process of silicon dipped includes preheating subsystem,annealing subsystem and baked detection subsystem.The wafer dippedsubsystem is the core of the whole system.The method of the dipped method improves the production rate of profit by automatic system.It simplifies the processes,such as the ingot,square root,head to tail,polishing,slicing,chamfering process.We simplify the processes to save the costs of the simplifying process equipment.It greatly reduces the production cost by simplifying the process and equipment.The new technology does not pollute the environment rather than the traditional process,and it makes a contribution to optimize the environment.It will not make ingot waste,because the new process simplified process cut silicon ingot with wire.The new process of making silicon is automatically controlled by PLC.The indicators according to the predetermined requirements makes the silicon wafers.The production cycle is shorten by the traditional manufacturing process,and it improves the production efficiency and expands the silicon wafer range of thickness and size.It can meet the different needs,simplify the process and saves raw materials.It greatly reduces cost to compared with the traditional manufacturing process.