Research On Low Temperature Anode Bonding Process Based On Dielectric Barrier Discharge

Anodic bonding has the advantages of simple process,simple equipment and good bonding quality.It is widely used in the fields of sensors,biology and optical MEMS devices.Conventional anode bonding occurs at high temperature.Due to the different coefficient of thermal expansion,the material has great thermal stress,which affects the performance of bonding components.Especially,it is not suitable for precision components,and the realization of low temperature anode bonding has become the focus of research.At present,the low temperature anode bonding process mainly includes chemical treatment,new materials and plasma treatment.Among them,plasma is not polluted,high efficiency and has great development prospect in the surface modification of materials.Dielectric barrier discharge(DBD)The method of generating plasma is simple and suitable for industrial production.Therefore,the method of realizing low temperature anode bonding after activation of bonding material by dielectric barrier discharge is studied in this paper.In this paper,the traditional anodic bonding process is introduced,and the reason why the anode bonding is difficult to be achieved at low temperature is analyzed.In this paper,the traditional anodic bonding process is introduced,and the reason why the anode bonding is difficult to be realized at low temperature is analyzed.From the theoretical point of view,it is discussed that the dielectric barrier discharge affects the anode bonding by changing the surface properties of the material,and it is proved that the low temperature anode bonding can be realized.The surface performance is related to the discharge state.Firstly,the key factors influencing the discharge state are found by the theoretical model of dielectric barrier discharge.Then,through the experiment,the influence of these key factors on the discharge state was studied,and the selection of these key factors was determined.The effect of DBD on the surface properties of the material was studied.On the basis of activation,the experiment of low temperature anodic bonding was carried out.The influence of surface properties on the anodic bonding was studied with the bonding strength as an index.Finally,it is concluded that when the surface roughness and the hydrophilic angle of the material become smaller,the anodic bonding strength becomes larger,When the anode bonding strength is the largest,the corresponding surface roughness is the smallest,and the hydrophilic angle is stable.According to the above conclusions,the DBD discharge activation process parameter,which is most favorable for anode bonding,is the discharge activation parameter when the surface roughness of the material is minimum after activation.The orthogonal experiment was carried out with DBD discharge parameters as experimental factors and roughness as experimental results.According to the experimental results,the dielectric barrier discharge model was established to determine the best activation parameters.Finally,the anodic bonding orthogonal test was carried out after the activation of the best parameters.The bonding temperature,bonding voltage and bonding time were the factors,and the bonding strength was According to the experimental results,the process model was established,and the optimum low temperature anode bonding parameters were obtained.