Research On Spreading Resistance And Thermal Coupling Of Multi-Chip Module

With the rapid development of science and technology, Multi-Chip Module technology attracts much more attention in researching and developing electronic products because of its special characteristics, such as small volume, high packaging density, high performance,high reliability and so on. At the same time, along with the increase in product features and power dissipation per volume, the heat flux density of equipment tends to be higher, which will cause the electronic components overheating problems and distort the reliability of equipment seriously. Heat dissipation has become an essential task in the design of electronic equipment. Through the research method combining theory, simulation and experiment, the following work has been studied in this paper.Firstly, putting the spreading resistance of single-chip module as the research object, the characteristics of various correlation calculation theories are analyzed. For a single rectangular model, the accuracy of the simulation is verified by comparing the results of theoretical calculation and FLOEFD simulation. On this basis, the relation between spreading resistance and model parameters is studied, and the response model of spreading resistance is obtained by using response surface method, which can provide a reference for improving the thermal performance of electronic products.Secondly, according to the phenomenon of thermal coupling of Multi-Chip Module, the temperature of two-chip module and four-chip module are calculated respectively by establishing the thermal resistance network and the thermal resistance matrix. Then the results are compared with the FLOEFD simulation values to validate the rightness of simulation. The effect of the change of model parameters on the thermal coupling is studied by simulation analysis, which has great reference sense to the thermal reliability design of Multi-Chip Module.Finally, in order to verify the thermal resistance performance of Multi-Chip Module through experiments, the thermal experimental platform of spreading resistance and thermal coupling are designed and built, which can obtain the temperature of chip and substrate. On this basis, the variation law between the thermal resistance and the parameters of the research model is further verified by comparing the experimental values and the simulation results. At last, the possible errors in experiments are analyzed.