Research On 60GHZ Antenna And Chip Packaging

With the increasing demands of the communication speed and quality, the traditional wireless communication technology cannot meet the Gbps communication requirements. With the feature of unlicensed wideband spectrum,60GHz communication system can be regarded as a perfect candidate for the future short range high data rate applications. Considering the 60 GHz RF system commercial application, the design of antenna and packaging is very important. Therefore, this thesis focuses on design and implementation of the antenna and RF chip packaging.With the PCB process, a 60 GHz high gain broadband antenna and low loss packaging are designed. Considering the advantages of the micro-strip antenna, like low profile, high gain, easy integration and narrow bandwidth, the stacked slot coupled micro-strip antenna structure is used. The stacked patch and slot coupling technology is introduced, increasing the bandwidth and reducing the back radiation. Then based on the above antenna element, in order to improve the antenna gain, the antenna array of 2 X 2 is designed, including the feeding network. Finally, the antenna array are fabricated and tested to achieve about 15GHz bandwidth and 12dBi Gain. At the same time, using the ground compensation interconnect techniques, the 60GHz package matching network is realized, improving time efficiency and bandwidth. The simulation results show that the insertion loss is about 0.3dB loss over 20GHz bandwidth.