Study On Real Time Dispatch In Semiconductor Manufacturing

With the quick development of semiconductor, the competition among semiconductor fabs is becoming more and more intense. The OEM enterprises in United States, Japan, and South Korea have gradually realized that the key to competition is not only limited to the advanced technology, stable yield and rapid reaction to the production cycle are also becoming increasingly prominent.Under this circumstance, the importance of the advanced production management method had become prominent. This paper focuses on how semiconductor enterprises improve their management methods. This paper also researches on the method of production cycle. We provide detailed discussion on complicated semiconductor equipment conditions of limit and the dispatching methodFor the semiconductor dispatch strategy, we focus on product accumulation of bottleneck equipment, beginning with a discussion of typical semiconductor foundry equipment operation method and the way to improve the efficiency of equipment operation for different equipment qualifications. We consider different combinations of various products in order to improve the equipment operation efficiency.We discuss the pilot time of thin film growth equipment(PCO), and through which calculate each PCO equipment pilot ’ s capability of producing the most count of conditions and product. This helps to reduce the waiting time before PCO by reducing the times of pilot running, and thus increasing PCO production time. After testing, each product’s waiting time reduces from 4.5 hours to 4.2 hours, which is more than 7% reduction. The LPN Group production conditions optimization matching model discussion is supported by historical simulation data. We established a model to predict the incoming material in order to increase the group product selection count. As a result, the group number of products is improved and thus improves the count of each operation of the productions of LPN. As a result, the filling rate is increased by 11.6%. Lithography model focuses mainly on reducing reticle exchange times. The same reticle to products are grouped according to the priorities of the group products calculated by the entire packet prioritization. Lithographic apparatus arrange productions according to the order of each group to reduce equipment exchange cover plate membrane. The product’s waiting time of lithographic thus is reduced to 13. 6 hours from 18.3 hours.We can see that the production cycle of actual data under the real-time automatic dispatching method is better than pure static dispatch method, which constantly encourages us to work on it further.