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The Plastic Coplanarity Of Wireless Network Adapter PCMCIA Conn Improvement Based On Taguchi Static Test Design

Posted on:2016-06-29Degree:MasterType:Thesis
Country:ChinaCandidate:J H LuFull Text:PDF
GTID:2348330503994028Subject:Industrial engineering
Abstract/Summary:PDF Full Text Request
Wireless card is the terminal wireless network access equipment, with the increasing maturity of the development of wireless data transmission technology, the wireless card has gradually become the standard configuration of the electronic products.The reported based on the Foxconn Technology Group Co., Ltd. Electronic connectors Desktop products 2(DS2) wireless card(PCMCIA,WSD68pin) Terminal cancel the CCD(Charge-coupled Device) inspection project. As the most important part of the project, warpage which is the common problem of thin-walled plastic parts in molding industry was studied.This paper introduces the development situation of the thin-walled plastic parts and molding warpage of the research status at home and abroad. Study on the mechanism of the plastic parts from warping deformation and influence factors, and put forward the corresponding control strategy. Through brainstorming, in determining the measurement methods and the benchmark case, analysis of the product structure, personnel factors, die structure, material, machine and so on, according to the various influence factors and The Plastic coplanarity(warping) causal relationship between. In this paper through the Minitab, using ONE-WAY-AVOVA and cross validation to exclude the secondary factors and determine the main factors.In this paper, 68 PIN plastic connector of wireless network card as the research object, selects pressure, mold temperature, injection speed as the test factors, select the warpage as the evaluation index, Arrange the production test by Taguchi static test design. By the range analysis on the simulation results, found that injection speed was the main factor, and get a set of molding parameter optimization. In the optimized process parameters, using the CAE and Mold flow, found that increase feed design can reduce the warpage which caused by the too long flow length and the residual stress.Simulation optimization of molding parameters in Taguchi static test design and increase the product feed design by Mold flow, the actual production of plastic parts warpage was obviously improved, SPC showed that the improvement reached the target.
Keywords/Search Tags:wireless network card, connector, plastic warping, taguchi experimental design, six sigma
PDF Full Text Request
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