| In recent years,SmartCard has entered every aspect of people’s lives with the rapid development of information technology.Smart Card has high memory capacity,high logic computing ability and high security,so it widely applied in many fields,such as Telecommunication,Finance,Social Security,Traffic and Internet of Things.etc.In china integrated circuit industry area,the growth of SmartCard is most important.SmartCard is a kind of integrated circuit card,and its primary component is the SmartCard chip,which performance directly determines the quality of the SmartCard.This thesis expounds the research status of SmartCard chip design and it is concluded that mainstream design process of SmartCard chip is the Ultra-Deep-Submicron process with characteristic size of 55 nm.With the perspective of IC Digital Back-End design,this thesis analyzed of the new characteristics of Ultra-Deep-Submicron process.Then it analyzed the impact on IC Digital Back-End design with the new characteristics.Then author proposed the final solution against every impact under these new characteristics.Based on the research of the Digital Back-End design flow with Ultra-Deep-Submicron process,it completed the Digital Back-End design of a SIM-Card chip with 55 nm Embedded Flash Process.In the implementation process of the design,it proposed the special solution for problems of reliability and security.The specific implementation process introduced ECO method with APR tool and DSMA to implement quickly timing closure,at the same time it reduced the design cycle.In the end,this thesis explains all items and methods of verification,and a series of verification of the design results have been done.And all of the verification results are passed.It combines with the actual chip design,this thesis proposes the feasibility flow of the Digital Back-End design with the Ultra-Deep-Submicron process on SmartCard chip.The research in this thesis can be a reference in Digital Back-End design with Ultra-Deep-Submicron process for SmartCard chip.The design flow takes into account both performance and reliability,quality and cost,which improves the competitiveness of the designed chip in the market. |