Design And Realization Of Ku-band Transceiver Frequency Conversion Module Based On 3D Vertical Interconnection Packaging Technology

With the increasing of military and civilian needs,the research on radio frequency band is no longer confined to the lower frequency band,and the application of the higher frequency spectrum has become the trend of the development of modern communication technology.Here,the conversion components of Ku-band play an important role in wireless communication,remote sensing,electronic countermeasures and radar detection.Therefore,the study on Ku-band transceiver system is very necessary.On the basis of frequency conversion technology,this paper establishes the system circuit framework and technical index,and a deep research and design on the higher and lower frequency conversion module of Ku band transceiver is realized.In this paper,a second-time frequency conversion and transceiver circuit of Ku-band is designed.For receiver link circuit,after frequency conversion down to S-band is firstly finished,it is continuously down to the L-band narrowband.For transmitting link circuit,which can be regarded as a converse process of receiver,the design of three stages of amplifier circuit adopts bi-directional amplifiers in order to guarantee use for both link circuits.Switches are used to realize the switch of routes.The issue of matching,especially the passive components such as filters,can be guaranteed by adding fixed attenuators in circuit design or topology structure on both ends of coplanar waveguide,thus to weaken parasitic inductance of bondwire under high frequency caused by the mismatching in practice.The high density and high integration of frequency conversion module have become a new breakthrough for people to improve the circuit structure and stabilize the performance.In order to achieve the chip performance optimization and high level of integration of Ku-band monolithic microwave integrated circuits(MMIC),3D vertical interconnection micropackaging technology is adopted,using stack of solder balls on PCB,to accomplish compression of original large transceiver to the miniaturization machine.On the premise of guarantee index,the volume is decreased significantly.Miniaturized modules will consist of MEMS filters,FBAR filters and other chips of units,which are significantly considered upon points of function and volume.The whole idea of the paper can be divided into four aspects:1.The design of Ku-band frequency conversion transceiver module,including mixing link,the local oscillator circuit,etc.By using new 3D micropackaging technology,the active and passive components are designed,simulated and optimized,in combination of structural design.2.Considering the most prominent problem in 3D structure-electromagnetic compatibility,in the design scheme,electromagnetic interference is minimized in a large scale.3.Practically make the frequency conversion transceiver module,summarize the actual measurement results of the module and the simulation results,and carry out the reliability and stability test in a certain experimental environment.4.Compare 3D packaging of transceiver frequency conversion module and the volume of traditional microwave transceiver frequency conversion module by experiments,and with the experimental data the advantages of miniaturization are summarized.