Low Temperature Curing Nano-conductive Silver Paste Applied To Piezoelectric Composite Vibrators

Nano-conductive silver adhesive with both conductive and bonding phase is often used as an insulating material surface electrode layer.In this paper,a two-step method is used to explore a low temperature curable silver nano-conductive silver paste which is applied to the surface conduction treatment of the piezoelectric composite oscillator.The identified components are organic solvents,flake-like nano-silver particle filler and polymer matrix,wherein the polymer matrix comprises macromolecule epoxy resin,curing agent and other trace additives.The morphology and crystal structure of the cured silver layer were observed by thermal analysis,SEM,EDS and XRD.The universal testing machine was used to test the performance of the piezoelectric composite materials.The influence of various factors on the performance of the nano-conductive silver adhesive applied to the surface conduction treatment of the piezoelectric composite oscillator was studied.First of all,explore the ratio of nano-conductive silver adhesive components,the mass percentage(10wt%,60wt%and 30wt%)of the organic solvent,the flake nano-silver filler and the polymer matrix is determined to be constant,and only the mass ratio of the epoxy resin and the curing agent in the polymer matrix is changed.After a large number of experiments,when the epoxy resin:curing agent:trace additive = 100:150:10 in the nano-conductive silver adhesive has the best overall performance.The volume resistivity is 2.37×10-4?·cm,Silver layer adhesive strength and solder joint bonding strength are 5.13MPa and 7.93MPa,respectively.Simultaneously the slurry fluidity is good at this time and easy to coat the piezoelectric composite oscillator.Secondly,the low temperature curable nano-conductive silver adhesive with different epoxy resins(AG-80 and 618)were studied and applied to the surface conduction treatment of the piezoelectric composite oscillator.The results show that AG-80 epoxy resin nano-conductive silver adhesive has shorter curing time(30min),lower curing temperature(90?),lower volume resistivity(2.13×10-4?·cm)and higher bonding strength(7.6MPa).Thirdiy,exploration of Low Temperature Curable Nano-conductive Silver Glue with Different Curing Agents(EDA,TEOA,TEPA)for Electrodeposition of Piezoelectric Composite Surface Electrode.The results show that EDA is more suitable for low temperature curable conductive adhesives than TEOA and TEPA.EDA curing agent conductive silver adhesives has short curing time(30min),lower curing temperature(90?),lower volume resistivity(2.37×10-4?·cm)and higher bonding strength(7.93MPa).Finally,the effects of different flaky nano-silver particles content and different proportion of spherical micro-silver particles on the properties.of conductive silver glue were comprehensively studied.The results show that when the nano-silver particles reached 60wt%has the good crosslinking density.With the increase of the content of conductive fillers,the good conductive network path can be gradually formed,and the best volume resistivity of the nano-conductive silver adhesive can be reduced to 1.29×10-4?·cm.The flaky nano-silver particles and spherical micro-silver particles mixed with different proportions of conductive filler.To a certain extent,can improve the conductive silver conductive properties.