Study On The Controlling Approach For Dispensing Process And Dispensing Properties

In recent years,with the introduction of the concept of industrial 4.0,electronic products,especially mobile products,are developed in a more and more compact and lightweight way continuously.As the performance of electronic products becomes more powerful and the degree of integration and assembly density continue to increase,a significant portion of the power loss is converted into heat in electronic devices,resulting a dramatic increase of heat generation,which means that whether the heat dissipation is effective is very important for prolonging the lifetime and maintaining the reliability of the heat-generating electronic device.This trend provides opportunities for the development of thermal conductive materials.The purpose of thermal control for packaged electronic devices is to effectively reduce the heat and keep the temperature within the safe working range at the junction of the semiconductor device.Therefore,it is of great significance to study the dispensing performance and dispensing process control of the thermal conductive gel material.In this paper,through the theoretical research on the properties of thermal conductive gel with silicone oil based gel materials as the research object,some experiments were designed to improve the dispensing technology and dispensing performance by the addition of diluents and the resultant gel viscosity reduction and flow rate increase,without changing the original formulation and thermal conductivity.In addition,the prediction equation of the flow rate is obtained by MINITAB software with DOE method.