Research On Interface Behavior Of Steel/aluminum Composite Plate

With the rapid development of today's technology and economy,the society has put forward more and more strict requirements for metal materials,it's extremely difficult to find a single type of metal material to meet the requirements of the various properties in the process of actual use.Since aluminum/steel laminated composites have wear resistance,good mechanical properties,corrosion resistant,low density,high electrical conductivity and thermal conductivity,and it has a broad application prospect in the field of automible,aviation,cooking utensils and furniture.So it is a key project for us to improve interfacial bonding properties of steel/aluminum.In this article,steel/aluminum clad plates was produced by hot-rolling that different content of Si are added in the aluminum.By choosing different diffusion annealing system,to get composite plate with high bonding strength.The analysis method of metallographic microstructure,scanning electron microscopy(SEM),EDS energy spectrum analysis and bending machine were used to analysis the microstructure of composite interface,the rule of interface intermetallic compound formation and the location of composite board stripping fracture under different annealing temperature and time in this article.We also analyzed thermodynamics growth behavior of interface intermetallic compound.Then we can get the optimal results,the main conclusions are as follows:(1)The annealing system has the important influence on the formation and growth of the compound plate interface compound.With the increase of annealing time and annealing temperature,the composite board interface compound was gradually to form,and the thickness of compound was gradually to be larger.When the silicon content is 3.74%,the composite has not compound at below 610? annealing temperature.The compound was began in the annealing temperature of 610?.And the compound reached athickness of 60?m in the annealing temperature of 625 ?.(2)Annealing temperature affects the interfacial bonding strength of the composite plate.Al-2.41wt%Si alloy/steel composite panels under 610 ?heat treatment temperature,was fractured in the aluminum substrate,and whose stripping surface was the plastic state.After 625 ? annealing heat treatment,the composite plate was fractured on FeA13 phase which is brittle,and whose stripping surface was the brittle state.(3)The content of Si influences the formation and growth of compound plate interface compounds.There was almost no composite board compound of steel/aluminum composite plates at lower than 610? annealing treatment,when the silicon content is between 1.76%and 2.41%.At this point,silicon has been inhibiting the formation of compounds.When the silicon content is between 3.74%and 5.38%,the compound plate interface generates the thicker compound,and the silicon promotes the formation and the growth of the compound.(4)The composition of the compound plate interface is affected by the addition of Si.The formation of the compound plate interfacial compound is affected by the addition of Si.The interfacial compound of Al-3.74wt%Si alloy/steel composite plate was A14.5FeSi and Fe2Al5 when the annealing temperature is 610?.And the interface of pure aluminum and steel composite plate was FeAl3.(5)The critical temperature of the stainless steel/aluminum compound plate was lower than that of the low carbon steel/aluminum composite plate.The critical temperature of interfacial compound of Al-1.76wt.%Si alloy/low carbon steel clad plate was 625?,while the temperature of compound plate of Al-1.76wt.%Si alloy/stainless steel was 580 ?.The elements of Cr in the stainless steel were dissolved in the interfacial compound and promoted the formation of the compound.