Preparation And Properties Of Novel Functionalized Polyhedral Oligomeric Silsesquioxane And Its Low-dielectric Composites

With the increasing importance of the transmission of electronic information,people hope that the dielectric constant of packaging materials can be further reduced.Polyhedral oligomeric silsesquioxane(POSS)can not only effectively reduce the dielectric constant of materials,but also improve the comprehensive performance of materials.This article synthesized a novel POSS with sulfone functional groups,and two types of a matrix-polyethersulfone(PES)and E-51 epoxy-were selected to prepare composite materials through mixing or cross-linking curing.And the addition of POSS will comprehensively improve various properties of the materials.And work details were summarized below:1.4-chloro-4'-mercaptodiphenyl sulfone(CMDPS)and octa-vinyl POSS(OVS)were synthesized following literature.Two precursors were reacted via"dick chemistry" under UV light with different ratio of functional groups to obtain novel sulfone-based POSS with different content of sulfone groups.And the novel POSS was blended into PES with a different amount to obtain composite membrane materials.It was easy to observe that the novel POSS dispersed better with more content of sulfone groups according to SEM images.And the dielectric constant of the composite membrane was generally reduced,while the mechanical property was also improved,but the thermal property decreased.When a high content of 8-functional POSS was added,the thermal decomposition temperature of the composite membrane was the same as pure PES membrane.From this,we know that we successfully prepared a low dielectric constant composite membrane materials with excellent comprehensive performance.2.4,4'-Bismercaptodiphenyl sulfone(BMPS)was synthesized as a curing agent and participated in the curing of E-51 epoxy with polyetheramine(D230).According to the FTIR spectra,the BMPS was successfully introduced into the matrix and reacted with E-51 to generate C-S bonds.After the join of BMPS,the dielectric constant of the composite materials decreased from 4.3 to 3.62.And on mechanical properties,the composite materials showed rigid,both the strength and the modulus were increased.On the heat resistance,the addition of BMPS can effectively maintain the heat resistance of the E-51 matrix.3.In the BMPS and E-51 composite materials,a certain concentration of 6-functional POSS and 8-functional POSS were added,respectively.After adjusting the concentration of POSS and BMPS,the dielectric constant would constantly decrease.It proved that the novel POSS played a significant role in the preparation of low dielectric constant materials.With more POSS added,the composite materials showed rigid,and thermal properties were also changed.