Study On The Grinding Performance Of Vitrified Bond Fine Diamond Grinding Wheels

With the rapid development of computers,smart phones and other products,the integrated circuit(IC)industry is developing rapidly.Silicon wafer has always been the most widely used substrate material in the integrated circuit industry due to its excellent semiconductor performance.Rotation grinding with fine and even ultra-fine diamond grinding wheel is the leading technology for wafer grinding and back thinning process.The grinding performance of diamond grinding wheel has important influence on the quality and efficiency of ultra precision grinding of silicon wafer.Studies have shown that grinding wheel with smaller grain size have better grinding performance.Because of its good heat resistance,self sharpening and large porosity,ceramic bond is suitable for making fine grained diamond wheels.In China,IC industry is a huge and increasing business in terms of both manufacturing and consuming.However,most of the IC manufacturing enterprises adopt the grinding set-ups,grinding wheels and processes developed by foreign companies.In this period,the overall technical level is still obviously backward.it is urgent to systematically study the grinding performance of ceramic bond fine-grained diamond wheels.Therefore,the preparation process and grinding performance of ceramic bond fine-grained diamond grinding wheel were systematically studied in this paper.The main contents of this paper were as follows:(1)A depth of cut model for rotation grinding was established and used to analyze the relationship between depth of cut and grain size,wheel concentration,width of wheel section as well as parameters of grinding test.These work provided a theoretical basis for subsequent selection of corresponding parameters.(2)The formulation and preparation parameter of vitrified bond fine diamond grinding wheel were systematically studied from four aspects: abrasive,bond material,porosity and additive.The phase change of bond material in sinter process was analyzed,and the suitable temperature range was determined through experiments.The method of porosity control and the contribution of cerium oxide additive were studied.The complete formulation of wheel was determined.(3)Grinding experiment was carried out to test the grinding performance of vitrified bond fine diamond grinding wheel containing cerium oxide additive.The topography of the grinding wheel was observed.The surface quality and subsurface damage of the silicon wafer after grinding were studied to evaluate the grinding performance of grinding wheel.