Preparation And Electrical Conductivity Of Nano-micrometer Copper

In recent years,the use of printed electronics to prepare semiconductor devices and conductive circuits has received increasing attention.Due to its unique physical and chemical properties,highly conductive metal nanoparticles may become an important material in the printing/flexible electronics industry.In this paper,nano/micron copper particles with uniform morphology and stable performance were prepared,and they were configured into conductive adhesives.Conductive circuits were made by screen printing.The experimental conditions and parameters were studied and optimized to obtain the best conductivity and adhesion,antioxidant,printability and other properties.(1)Nano-copper,micro-copper and silver-coated copper particles were prepared using two different protective agents,and the products were characterized.The prepared copper has a particle size of 100-500 nm and a spherical shape.In this paper,the characteristics of the particles and the formation mechanism of the co-mixing coating were discussed in depth.The ideal nano-copper conductive adhesive circuit was prepared,which effectively improved the anti-oxidation of the nano-copper under natural conditions.(2)Using epoxy resin as a curing agent,terpineol,benzyl alcohol,dibutyl phthalate,tributyl phosphate,and turpentine as substrates to prepare conductive adhesives,effectively improving the adhesion of conductive circuits,and the conductive mechanism is studied.(3)In order to investigate the relationship between sintering temperature and sintering time and resistivity,a PET substrate was used and sintered at 160 °C to obtain a wire with a resistivity of 5.2 ?/cm.(3)Finally,using screen printing technology and PET as a substrate,the influence of different proportions of fillers and nanoparticles on the resistivity of printed wires was studied,which provided a reference for the next step of the research.