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A Kinematics And Dynamics Analysis Of Single-Lapping Copper Machine

Posted on:2017-11-09Degree:MasterType:Thesis
Country:ChinaCandidate:Q Q XieFull Text:PDF
GTID:2381330512461300Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
The Single–Lapping Copper Machine is mainly used for singled sided high precise grinding/polishing of sapphire substrate and window with sizes below or equal to eight inches,its processing quality and effect are much higher than other plane grinding machines.There is high precision requirement for finished product of sapphire substrate.The“485DP-4L Single-Lapping Copper Machine”was 2015 JiangXi new product planning program.This paper have researched its processing process by constructing and simulating by using of virtual prototype technology.Then made experimental research on process parameters that affect the stability of single sides copper grinding machine process,its optimizes process parameters and instructs to prepare the fine grinding process of sapphire substrate.Some analysis be made to deformation of under millstone,optimization design of main components and fatigue life etc;corresponding structure exploration for trimming device of copper plate be made.Finally it have developed self-owned intellectual property rights “485DP-4L Single–Lapping Copper Machine” with one company.This paper mainly makes following researches:1.Establish parameter model and realize virtual assembly for single sided copper grinding machine and make foundations for following dynamics and kinematics.Establish physical model for single sided copper grinding process,make corresponding dynamic simulation for grinding process of single sided grinding machine by establishing virtual prototype and analyze factors that affect grinding stability.Make corresponding experiments by using of processing process of virtual simulation and verify its grinding effect.2.In view of the hardness and stability of chemical properties,it needs greater pressure and long time during processing process,however,physical friction between artifacts will increase the temperature of copper plate and cause deformation of copper plate.By making thermal-structure coupling analysis for assemblies of lower millstone and it is found out,there is big change in displacement and deformation and greatly influenced by freezer temperature and plate temperature.Then,make multivariate simulation for lower millstone and get a set of suitable parameters(plate temperature,stainless steel plate and thickness of copper plate).3.Because sapphire substrate specification requires that surface flatness should not exceed 0.01 mm and surface roughness should achieve 0.3?m,therefore its components designing,verification and optimization are very important.First,make static analysis and optimization design for lower bearing seat,calculate natural frequency and mode of vibration through free model analysis and verify if it meets the requirements of equipment design.Calculate and analyze the stress distribution and deformation of welding base and attain stress distribution and deformation of welding base through analysing and then make improvement for the structure of welding base.Make numerical analysis and optimization for components common problems met in the practical using process of equipment;By making static analysis of main shaft,it proved that the analysis result meet stress intensity.Based on this,make improvement design for low speed shaft and verify its fatigue properties,get best structure,realize target of lightweight design and decrease cost for design and manufacturing.4.There is high requirement for the flatness of copper plate,which is that the trimming device must have high-precision requirements and stability requirements.Make analysis of turret structure by finite element method,verify the rationality of its structure.Processing copper plate surface with repairing device can meet the high-precision requirements of plate surface and make the surface meet performance requirements of processing technology of sapphire.This paper have made theoretical simulation and experimental researching on stability in processing process of single sided cooper grinding,which proposes a sets of relatively reasonable process parameters for customer.And provided the theoretical parameters for high-performance Single–Lapping Copper Machine.it has a certain reference value for improving the economy,reliable and stability of the equipment.
Keywords/Search Tags:Single-Lapping Copper Machine, Sapphire, Dynamics Simulation, Copper Plate Repairing Device, Heat-structure Coupling, Structure Optimization
PDF Full Text Request
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