Preparation And Properties Of Epoxy Composites With High Thermal Conductivities

At present,the application of aerospace research,automobile manufacturing,Marine transportation and other fields has significantly improved the demand for composite materials and the exploration of its potential value.Domestic and foreign researchers have carried out a large number of modification studies on polymer materials and other experimental work,which also have higher and higher requirements for the research and development of composite materials.A large number of electronic devices occupy the main body of social operation.The operation of electricity must generate heat,and the application of materials such as electronic equipment structure has a higher and higher demand for heat.Therefore,the application requirements of thermal conductivity composite materials affect the development of technological progress.In this paper,the research on boron nitride?BN?,aluminum nitride?AlN?is a thermal conductive filler,with epoxy resin as matrix,the preparation of different system of high thermal conductive resin,first choose thermal conductive filler silane coupling agent treatment,make the particle surface access amino groups,increasing thermal conductive filler surface active functional group,deal with filler particles to increase the thermal interface surface,and then add the thermal conductive filler epoxy resin matrix,then introduced to promote agent,curing agent,curing samples preparation of high thermal conductive composites,Using Fourier transform infrared spectroscopy?FTIR?,scanning electron microscopy?SEM?,X-ray diffraction?XRD?,differential scanning calorimetry?DSC?,thermogravimetric analyzer?TGA?and thermal conductivity tester analytical techniques,such as the characterization of thermal conductive filler particles modified,characterization of thermal conductivity of composite microstructure,analysis the comprehensive performance of materials.The results show that the thermal conductivity of the composites increases with the addition of BN and AlN particles,and the thermal stability is better.The thermal conductivity and thermal stability of BN epoxy resin and AlN epoxy resin composites with modified filler were better than those without modified filler.The thermal conductivity of the composites increases with the increase of BN particle size.The filler particles can be evenly dispersed in the system.When the addition amount of BN particles is 30 wt%,the thermal conductivity of the composite increases to 0.921 wm^-1k^-1,and the comprehensive performance of the material is the best.When the addition amount of AlN particles was 20 wt%,the thermal conductivity of the composite material increased to 0.58 wm^-1k^-1,and the comprehensive performance of the material was the best.