Study On The Tensile Ductility Of Printed Circuit By Using IME Conductive Ink

In-mold electronic technology(IME)is a new technology which integrates in-mold decoration technology(IMD)and printing electronics technology,and it is a new way to realize advanced circuit design and architecture.This technology can be used to upgrade the single-function in-mold decoration products to intelligent,spontaneous light and touchable electronic functional products.As an emerging technology,IME still has many defects in the process,especially when the film substrate is molding after the printed circuit ending curing.Because the form process of the film substrate involves the stretch of the printing circuit,the excessive stretch rate will lead to the increase of the resistance value of the circuit and even fracture.Therefore,research on the stretch ductility of IME conductive ink printed circuit is urgently needed.The main contents of this paper are as follows:(1)About the curing problem of conductive ink before stretching of printed circuit,the influence factors of ink curing are studied through preliminary tests.Based on the results of the preliminary test,the relationship between the temperature and the curing of the ink,the determination of the complete curing condition of the ink printing circuit,and the variation of the resistance value of the line during the curing process is studied in detail.The conclude is that the printing circuit completely curing conditions for curing temperature 150?,the curing time 8 min.(2)To solve the problem that the printing circuit is easy to break after fully cured,through the tensile test of the printed circuit,study on the variation of the surface feature and the resistance of the lines before or after stretched.The conclude is that the optimal tensile load of the tensile test is 2kN,the optimal tensile rate of the tensile test is 5mm/min,and the main factor influence the variation of the line resistance during the stretching process is the line cross section area.(3)Through the research of the curing experiment and the stretching experiment,this paper puts forward the experimental method of curing by stretching to improve the problemof easy fracture of the printing circuit.Research the variation rule of resistance value and ductility rate under the experimental condition of curing by stretching.The conclude is that the require time of line fracture is 544.6s and the maximum extension of printed circuit is138.53 mm.(4)The research of the curing by stretching experiment of printed circuit is carried out in the polymer tensile testing machine.The result shows that compare with first curing and then stretching experiment,the time require for line fracture increases by 74.33%,the maximum extension of printed circuit increases by 14.43%,and the electrical resistance of printed circuit decreases by 76.45% under the condition of curing by stretching.The innovative point of this paper is to put forward the research method of combining the curing process and stretching process of the printed circuit into the polymer tensile testing machine,and to carry out the study of the curing by stretching process of the printed circuit.This method improves the ductility of the printed circuit and reduces the resistance of the printed circuit.The resistance of the printed circuit is reduced by 76.45% when the extension is 14.43%.This paper is based on the unidirectional tensile test of the printed circuit,the multi-directional tensile test of the printed circuit is not covered in this paper.This part needs further study.