Preparation And Application Of High Performance Epoxy Resin Material For Electronic Packaging

Epoxy resins,a class of thermosetting resins,own a lot of excellent properties after cured by hardeners,including water resistance,heat resistance,chemical resistance,electric insulation,mechanical properties.Thus,they have been indispensable materials for electronic packaging.As packaging materials,low viscosity and good mobility are demanded.In this paper,we began to study on the synthesis of epoxy prepolymer and latent curing agent,and prepare a new one-component liquid epoxy packaging material with low viscosity,good mobility,heat resistance,excellent storage stability and so on.The main contents are as follows:?1?Divinylbenzene was used as raw material to synthesize diphenyloxirane via H₂O₂epoxidation.We investigated various influencing factors on reaction,and obtained the optimal conditions:PEG-400 acted as phasetransfercatalyst,NaHCO₃ played additive,acetonitrile served as solvent,n?divinylbenzene?:n?H₂O₂?=1:18,V?divinylbenzene?:V?acetonitrile?=1:12,32?,24 h.Under these reaction conditions,divinylbenzene was almost completely used up.In addition,diphenyloxirane reached a purity of 90%.?2?Novolac resin and 2,4,6-tris?dimethylaminomethyl?phenol?DMP-30?were used as raw materials to synthesize new latent curing agents?LC?via hydrogen bonding.Compared with the melting method,the force of hydrogen bond of LC prepared by solvent method was stronger.Among all kinds of LCs,there were the strongest hydrogen bond and latent property in LC-20,which was prepared by DMP-30 and novolac resin with mass ratio of 20:100.And the gelation time at room temperature of E-44/LC-20 was also the longest,which lasted 120 day.?3?Curing processes and thermal properties of latent curing mixture E-44/LC-20 and ordinary curing mixture E-44/novolac resin/DMP-30 were analyzed.Compared with E-44/novolac resin/DMP-30,latent curing mixture E-44/LC-20 had longer gelation time at room temperature,higher curing starting temperature,faster curing rate and better thermal stability.The curing kinetics of latent curing mixture E-44/LC-20 were investigated by non-isothermal DSC method,and the curing conditions and kinetic parameters were determined.And the n order kinetic model equation of latent curing mixture E-44/LC-20 was established.