Study On Thermal Conductive And Heat Dissipation Integrated Polymer Composites Material Prepared By Spacial Confining Forced Network Assembly

With the continuous development of intelligent devices in modern society,many electronics are getting smaller and smaller.The high heat which can not be dispersed from the internal components of these devices in time will seriously reduce the service lifetime of the equipment.Many scholars are devoted to the research of high thermal conduction and high heat dissipation.Metals have good thermal conductivity and polymers have good heat-dissipation.However,neither metal nor polymer can give consideration to both good thermal conductivity and heat dissipation performance.Metal-plastic composite microstructure heat radiator comprehensively utilizes the thermal conductivity of metals and heat dissipation performance of polymers.But the interface thermal resistance between metal and plastic is excessive.It can not achieve the ideal balance of heat conduction and heat dissipation.The processing technology is complex.This paper based on the theory of heat conduction and heat dissipation have established an integrated heat conduction and heat dissipation model of composites with microstructures.Using MATLAB software have explored the balance law of heat conduction and heat dissipation capacity of composite materials.Using spacial confining forced network assembly improve the thermal conductivity of materials and increasing its specific surface area enhance the heat dissipation capacity of material to achieve the balance of heat conduction and heat dissipation.Finally,the thermal conductive and heat dissipation integrated polymer composites material have been tested for thermal conductive and heat dissipation performance.By comparing with theoretical simulations,the consistency between theoretical and practical tests have been proved.The main research contents include:(1)An model of thermal conductive and heat dissipation integrated polymer composites material for microstructures was established.The heat conduction and heat dissipation process of the V-groove microstructure material was numerically simulated based on MATLAB software.(2)PDMS/SCF and PDMS/SCF/CNT thermal conductive composites were prepared by SCFNA.The influence of internal mixing process on the dispersion uniformity and length of filler SCF was studied to the optimum process parameters.The effects of PDMS with different viscosity,different fillers,different filler concentration and forced assembly process on thermal conductivity of composites were studied.(3)PDMS/SCF/CNT thermal conductive and heat dissipation integrated polymer composites with microchannel structure were fabricated by SCFNA.The results of thermal conductivity and heat dissipation tests were compared with the simulation results,which proved that experimental results were consistent with the simulation results.