Effect Of Copper Ion Complex On Thermal Properties Of ABS

With the rapid development of electronics and other industries,the traditional metal thermal conductive materials have gradually declined.Thermal conductive polymer materials have become a hot research topic in the field of thermal conductive materials.As an engineering plastic with excellent comprehensive performance,ABS is regarded as an excellent carrier for thermal conductive polymer materials.Limited by the lower thermal conductivity of ABS materials and other properties caused by traditional thermal conductive fillers,the development of new thermal conductive fillers has become a focus of research on thermally conductive polymer materials.As a new functional molecular material with unique spatial topology and rich properties,copper ion complex has great potential in thermal applications.In this paper,Cu(Sal)2 and Cu(phen)2Cl2 complexes were synthesized by hydrothermal method,and the synthetic experimental conditions were explored in order to obtain the best reaction conditions;ABS/Cu(?)complex composites were prepared by melt blending at low filling ratio,the effects of Cu(?)complex on thermal conductivity,thermal expansion,thermal stability and thermal resistance of ABS were investigated under different filling content and different blending ratio;The composite Al2O3 filler of Cu(phen)2Cl2 complex was prepared by sol-gel method,and the surface of the composite Al2O3 filler was mixed with ABS resin to explore the Cu(phen)2Cl2 coordination in the composite filler.The effect of content on the thermal properties of ABS was compared with that of surface modified Al2O3filler and marketed Al2O3 filler.The results showed that:?.Controlling the appropriate reaction timc and temperature can effectively increase the yield of two Cu(?)complexes.The maximum yield can be achieved by reacting Cu(Sal)2 at 70? for 3h,and the maximum yield can be achieved by reacting Cu(Phen)2Cl2 at 70? for 4h.?.When a single Cu(?)complex is filled,ABS/Cu(Sal)2 composite and ABS/Cu(phen)2C12 composite have the highest thermal conductivity and the best comprehensive thermal performance when the filling amount is 3%;When the two Cu(?)complexes are compounded,the thermal properties of the ABS composites are best when the compounding ratio is Cu(Sal)2:Cu(phen)2Cl2=2:4;Compared with the single component filling,the thermal properties are improved,especially in improving thermal conductivity,reducing thermal expansion and increasing processing fluidity.?.When Al2O3 doped Cu(phen)2Cl2 is used as the composite filler,the comprehensive thermal performance of ABS composite is best when the content of Cu(phen)2Cl2 is 4%,and the thermal conductivity and heat resistance of ABS composites were better than those of commercial Al2O3 composites.The interface effect between the two phases was improved after the surface treatment of the composite filler with KH550,and the thermal properties of the composite filler were improved obviously.