Research On Reduced Graphene Oxide Loaded Nanoparticles Doped Copper Matrix Composites

Copper and copper alloys are widely used in electronics,communications,rail transit,instrumentation and other fields due to their excellent physical properties and certain mechanical properties.The annual market usage is estimated to be around several hundred million yuan.At present,the method of preparing copper alloys with excellent performance internationally is to increase the strength and hardness of the copper alloy,but it inevitably comes at the expense of the conductivity of the copper alloy.Can not really achieve the effect of both,this study is to use graphene's excellent mechanical and physical properties,add it as a reinforcing phase to the copper alloy,hoping to obtain a copper matrix composite with excellent performance.However,graphene is relatively thin,it is easy to agglomerate itself,it is difficult to uniformly dope into the copper alloy,and the interface between the copper matrix and graphene is wetted.In this paper,the problems of poor agglomeration of graphene agglomeration and poor adhesion to the copper matrix are improved by hydrothermal method and electroless plating method of loading rare earth CeO2 and metal particles Ag on graphene,respectively.Then graphene/copper matrix composites were prepared by spark plasma sintering(SPS)and melt casting methods.The microstructure,SEM,Raman spectroscopy,XRD,TEM and other methods were used to study the structure and composition of copper matrix composites.The existence state of graphene,and measured the hardness,density,conductivity and tensile strength of graphene/Cu composite materials.research shows:1.Graphite oxide powder was prepared by the Hummers method.CeCl3·7H2O was used as the main salt and graphene oxide was evenly dispersed.After hydrothermal reaction at 120?in the reactor for 12 h,and the CeO2 particles are uniformly loaded on graphene.2.Graphene-loaded Ag composite powder was prepared by electroless plating.The silver ammonia solution and graphene were mixed evenly and then reacted with glucose as a reducing agent at 95? for 1 hour.The graphene-loaded Ag was obtainea oy ireeze-drying for 36 hours Compound powder.The Ag particles loaded on the graphcne are relatively uniform and theparticles are clear.3.Graphcnc-loaded particle powder of 0.25 wt%and copper powder are ball-milled at 350 r/min for 4 h,sintering temperature is 800?,and sintered 150 MPa and 40 MPa for 10min to obtain graphene/Cu composite.At a pressure of 150MPa the hardness of the graphene-loaded Ce/Cu composite is 53 HV,and the conductivity of the composite is 85.7%IACS.At a pressure of 40MPa,the hardness of the graphene-loaded Ce/Cu composite is 69.95 HV.The conductivity reached 92.1%IACS.The tensile strength of the graphene-loaded Ce/CuCrZr composite material is 219 MPa.The tensile strength of the graphene-loaded Ce/Cu composite is 188 MPa,which is 9.3%higher than that of the unloaded grapheme/Cu composite.4.Graphene/Cu composite materials were prepared by vacuum arc casting.Drilling of CuCrZr alloy,add 0.25 wt%of graphene to the CuCrZr alloy,and melt-cast under argon atmosphere.The graphene exists in the form of graphene on the copper matrix The surface and copper particles form agglomerated large particles.The hardness of the graphene-loaded Ce/CuCrZr composite is 115 HV,and the conductivity is 72%IACS.