Research On Design And Application Of Bipolar Electrode Metal Pattern Deposition Device

The current vigorous development of information technology,along with the continuous upgrading of smart devices such as computers,mobile phones,smart watches and other products,puts forward higher requirements for the lines that play the role of information transmission and component connection;in addition,existing printed circuits During the manufacturing process of the board,especially during the manufacture and use of the high-density multilayer board,it is inevitable that some defects will appear.Convenient positioning and repair can greatly reduce production costs.In this paper,two metal patterning methods are proposed to achieve the fixed-point deposition of materials: one is to design electrodes with different cathode structure distribution,and a pattern similar to the electrode shape is deposited on the substrate;the other is to prepare electrodes with cavities of different shapes So that a pattern similar to the electrode cavity is deposited on the substrate.According to scheme one,through self-made driving electrodes,when the external power is turned on,a plurality of driving cathodes and driving anodes work together to form a cathode deposition area on the substrate similar to the distribution of the cathode electrodes,thereby directly preparing a metal of a specific shape pattern.The second option is to expand and control the cathode deposition area of the bipolar electrode by driving the anode cavity.This experiment mainly deposits Cu,as well as Cu and Ni alloys,and characterizes the structure of the material by field emission scanning electron microscope(FESEM).In the specific implementation process,the influence of factors such as voltage,deposition time,the distance between the electrode bottom and the substrate,and the flow rate of the electrolyte on the deposition process and the resulting metal pattern was investigated.Change to analyze the influence of various factors.According to the experimental results,the external voltage is 8v,the distance between the substrate and the bottom of the electrode is 0.8mm,and the deposition time is 60 s.The second scheme can deposit a figure with a clear outline when the voltage is above 9v.The optimal deposition time is 60 s,and the distance between the substrate and the bottom of the electrode is 0.1mm.Under the optimal conditions of these two experiments,the ideal results of the experiment can be obtained.In summary,the bipolar electrochemical method can be used to achieve fixed-point metal deposition,which is a high-precision,multi-purpose,and convenient processing metal deposition scheme.It has broken through the limitation of the entire surface processing of metal deposition,realized a convenient local partial deposition process,and reduced the metal patterning preparation process,which is of great significance to the technical fields of metal processing at room temperature,complex metal pattern preparation,etc.