Structural Design And Application Of Heat Sink Materials

With the development of electronic components,electronic chips with stronger functions and higher integration have been continuously designed.In order to ensure that the high-power chip can continue to work stably in a high heat flux environment,chip heat dissipation structure is essential.First of all,I compared and studied a variety of micro-channel cold plate structures,and selected the snowflake structure as the basic structure of the heat sink material structured space topology.Secondly,I optimized the structured materials in order to expect better heat dissipation and temperature average properties.Finally,I applied the optimized heat sink structured material to the heat dissipation of electronic components.In this paper,the specific work is as follows:Research on Thermal Simulation Boundary Conditions.I took the conventional DC channel radiator as the research object to study the influence of commonly used heat dissipation materials and fluids on the heat dissipation capacity.I chose reasonable materials and fluids as the boundary conditions for subsequent thermal research.Research on Micro-channel Heat Dissipation Structure.I analyzed and studied the heat transfer of various breakpoint microchannel structures,designed the snowflake microchannel structure and verified the feasibility of this structure.Heat sink material structured design.I put the snowflake microchannel structure in a spatial arrangement according to a certain arrangement.Then I optimized and proposed the idea of a multi-layer interactive structure,compared and analyzed four different multilayer optimized structures,and selected the optimal scheme structure by comprehensively considering the pressure drop,heat dissipation and average temperature properties.And I further optimized this structure to improve the average temperature performance of heat sink structured materials.In order to reflect the excellent properties of heat sink structured materials for heat dissipation and temperature uniformity,I set up a control experiment.Compared with the results of the simulation thermal analysis,the results of the heat sink structured materials are the best.I apply this material to the field of lithography,it can effectively reduce the deformation caused by temperature...