Micro-nano-scale Porous Surfaces Used For Enhancement Of Heat Dissipation In Semiconductor Refrigeration Hot Ends

Semiconductor refrigeration technology is a new kind of refrigeration technology,which has good application prospect.However,compared with traditional refrigeration technology,the refrigeration efficiency of semiconductor technology is relatively low.There are many factors that influence the refrigeration efficiency of semiconductor refrigeration technology.In this paper,the experimental research is carried out mainly from the hot end heat dissipation method of semiconductor refrigeration technology.The improvement of the whole cooling efficiency of the semiconductor refrigeration technology is promoted by strengthening the heat transfer performance of the heat end.The author designed a heat transfer method for semiconductor refrigeration technology.The preparation and experimental research of this heat dissipation method have mainly done several aspects:(1)Preparation of ceramic surface metal film.Most of the external packaging surface of semiconductor refrigeration technology is ceramic surface.The heat dissipation method designed by the author needs to electroplate porous metal surface on the hot end surface of the semiconductor refrigerator.Before that,it is necessary to prepare a metal film on the surface of the ceramic so that it can conduct electricity and prepare for the next step.The method used is electroless plating.The authors refer to the relevant literature and experimental research to summarize a set of preparation process of electroless copper plating.According to this process,a layer of metal film is prepared on the ceramic surface of a semiconductor refrigerator.(2)Preparation of Micro-Nanoscale Porous SurfacesThe authors summarized a set of feasible electroplating processes by referring to the relevant literature and experimental studies.Using this process,micro-nanoscale porous surfaces can be prepared on the heat-dissipation surfaces of electroless-plated semiconductor refrigerators.Electroplating is carried out under high current conditions,during which the cathode produces a precipitation of elemental copper and also produces hydrogen gas that eventually forms a porous structure.(3)Boiling Heat Transfer Experimental Platform and Experimental StudyFor the preparation of micro-nano-scale porous surface need to test its heat transfer performance,so build a pool boiling heat transfer experimental platform.The author designs,processes,and assembles the various components required for the experimental platform.Using deionized water as the heat transfer medium,an experimental study was conducted on the micro-nano-scale porous surface prepared under different methods and under different experimental conditions.By analyzing the boiling heat transfer characteristics of micro-nano-scale porous surfaces,the micro-nano-scale porous surface suitable for this experiment was selected.(4)Semiconductor Refrigeration System Experiment Platform and Experimental Study.The phase-change heat sink designed and manufactured by the author for use in semiconductor refrigeration systems consists of two parts,one is a boiling heat transfer surface module and the other is a heat pipe cooling module.The boiling heat transfer surface module is a layer of micro-nano-scale porous surface on the hot end surface of the semiconductor refrigerator,which can quickly and effectively move the heat generated by the semiconductor refrigerator in the semiconductor refrigeration system away from the hot end surface.The heat pipe radiating module transfers heat to the surrounding environment through air cooling.The two modules are connected and sealed by acrylic material.The author designed and built an experimental platform for semiconductor refrigeration systems and applied the designed radiators to semiconductor refrigeration systems for experimental research.Through the analysis of the experimental results of the semiconductor refrigeration system,the following conclusions have been drawn:This article mainly compares the effects of air-cooled radiators,heat-pipe radiators,water-cooled radiators,and phase-change radiators on the refrigeration performance of semiconductor refrigeration systems.It is found that phase-change heat sinks can effectively expand the semiconductor cooling system compared to the other three types of heat sinks.At the same time,phase change heat sinks are less affected by environmental factors than the other three types of heat sinks,and at high heat flux densities,the energy efficiency ratio of semiconductor refrigeration systems equipped with phase change heat sinks is superior to that of semiconductor refrigeration systems equipped with other three types of heat sinks.In energy efficiency.