A Study On Thermal Impedance Model And Junction Temperature Prediction Of High-Power Press-Pack IGBT Module

The voltage source converter based on the insulated gate bipolar transistor IGBT has been widely used in DC power transmission system.Compared with traditional welding IGBT,IGBT module has a good application prospect because of its double side heat dissipation,short circuit failure,high reliability and so on.Multi chip compact layout and double-sided cooling to chip thermal coupling,crimp type IGBT radiator effect is more outstanding,in order to avoid module chip thermal failure threat to the safe and reliable operation of HVDC system,the research for crimping IGBT valve can reflect the equivalent heat network model of internal heat distribution module,and then fast electric co simulation to predict the junction temperature of the chip to realize the electrical system is very necessary.Firstly,the complex model and decoupling method of flexible straight valve universal valve in electro thermal fluid multi physical field,the junction temperature and loss of converter valve prediction model can be simplified to:the radiator module fluid conditions as the input,each IGBT module and radiator sub unit electric thermal model independent the simulation of the problem.The modeling and simulation scale of the equivalent thermal network model can be significantly reduced.Then the decoupling unit considering water cooling and heat coupling between chip on chip junction effect of temperature distribution,the thermal field analysis of sub unit based on the numerical model,put forward a kind of inter chip thermal coupling,including radiator steady and transient equivalent thermal network model and parameter extraction method considering.The parameters of the model can be modified with the steady-state thermal resistance under different operating conditions,the radiator flow,under different working conditions,the radiator flow quickly,get the module within the chip junction temperature distribution;transient thermal network model and mathematical model to predict the transient junction temperature characteristics,can accurately reflect the transient conditions of junction temperature fluctuations.In addition,the main factors affecting the thermal coupling of the modules are studied,which can provide the basis for next studies to improve the equivalent thermal model and radiator optimization design.