Research And Manufacture Of The Composite Components Of Phase Change Heat Transfer And Phase Change Heat Storage

As the two main application fields of Phase Change Technology,Phase Change Heat Storage Technology and Phase Change Heat Transfer Technology are highly concerned by researchers.As the core of the Phase Change Heat Storage Technology,the phase change material(PCM)has high energy storage density,and can absorb and release energy by using the material's own physical state change.It is a technology with great development prospects in the flied of energy storage.Also,in the field of electronic devices heat dissipation,the temperature control performance of this technology is excellent.The Phase Change Heat Transfer Technology is based on heat pipe(HP)technology,which possesses efficient heat transfer based on liquid-vapor phase change.It has the advantages of light weight,high efficiency heat conduction,excellent average temperature performance and the fast response,which makes HP widely used in energy,chemical,aerospace and Various fields of electronic components for military civilian use.Moreover,the combination of Phase Change Heat Storage Technology and Phase Change Heat Transfer Technology has also attracted the attention of researchers as a new research direction.On this basis,this paper will explore the performance of composite components for Phase Change Heat Transfer Technology and Phase Change Heat Storage Technology.Through the combination of heat pipe(HP)and phase change material(PCM),thermal storage performance,heat transfer performance,and temperature control performance of thermal management systems by the composite phase change technology is explored.The main work of this paper is as follows:(1)Based on the principle and theory of Phase Change Heat Storage Technology and Phase Change Heat Transfer Technology,two finite element model of a heat pipe-based paraffinassisted composite component(HP-PCM composite component)and a paraffin-based heat pipe-assisted composite component(PCM-HP composite component)are established,and also solved by the software ANSYS ICEPAK.The latent heat absorption of PCM improves the heat dissipation efficiency of HP-PCM composite component,while the HP-PCM system has a lower steady-state temperature.The array of heat pipe clusters greatly increases the heat storage rate of PCM.PCM-HP composite component has a higher heat storage rate on the optimized structure that HPs are adhered to the heat source surface.(2)A heat pipe-based paraffin-assisted composite component—Composite heat pipe(CHP)was prepared,and the preparation process of CHP was summarized.The temperature test platform was designed and built to explore the heat transfer performance,steady state performance,uniform temperature performance of the Composite heat pipe(CHP).Also,the performance under different heat dissipation conditions and different working conditions was investigated.It was found that the CHP with a PCM filling rate of 75% has a temperature drop of 9.31% in terms of steady-state temperature compared to a conventional heat pipe(filling rate of 0%).CHP also has good isothermality,and the excellent performance when facing with thermal shock and cyclic thermal stress.(3)A paraffin-based heat pipe-assisted composite component(PCM-HP composite component)were prepared,and a visualized thermal performance experimental test platform was built.Three different kinds of heat pipe clusters according to shapes and heat transfer modes(one end heating-one end cooling mode and two end cooling-middle heating mode)in PCM-HP composite component were tested in heat storage heat transfer performance test and visual observation,also with a pure paraffin sample.The PCM-HP composite component with the heat pipe cluster improves the heat storage efficiency of the system,and the heat transfer mode that one end heating-one end cooling has better heat transfer performance.Although the PCM-HP composite component reduces the temperature control time of the heat source,it also reduces the steady-state temperature control in heating process.