Thermal Analysis And Heat Dissipation Optimization Of Electric Scooter Driver Board

With the rapid development of electronic information technology,high-power,integrated electronic devices are widely used in electric scooter driver board.Because of the dense arrangement of electronic devices on the driver board,the heat flux increases and the temperature rises rapidly.The driver board is prone to overheating.High temperature is one of the main reasons for the failure of electronic devices,which seriously affects the reliability of the driver board.Therefore,research on thermal analysis and thermal design of the drive board is the key to improve its reliability.Aiming at the problem that the temperature of the electronic device on the driver board is too high and the mutual influence between multiple heat sources leads to the reliability of the device,a finite element method suitable for the thermal analysis of the driver board is adopted,and the optimal design of the heat dissipation of the driver board is carried out,so as to reduce the temperature of the circuit board and the electronic devices.The main research work is as follows:(1)According to the mechanical structure and functional requirements of the electric scooter,the electric scooter driver board was designed.Through the analysis of the basic theory and basic methods of thermal analysis,the basic types and analysis levels of the thermal analysis of the driver board are clarified.The power consumption of each power module of the driver board is calculated by using experimental data and theoretical formula,and the heat dissipation path of the main heating device of the power module is analyzed.(2)In order to further understand the temperature distribution of the driver board,the power device is modeled in detail by SolidWorks drawing software,and the three-dimensional model of the driver board is drawn according to the actual layout of the electronic devices on the driver board.The three-dimensional model of driving board is imported into ANSYS for thermodynamic finite element analysis,and the steady-state temperature values of each electronic device are obtained by simulation.Set up the driver board temperature detection experimental platform,design the experimental scheme,and use the infrared thermometer to obtain the temperature distribution of the driver board and the surface temperature of the power device.The ANSYS simulation results and experimental results are compared and analyzed to verify the accuracy of the finite element simulation model of the driver board established in this paper.(3)Through the analysis of the heat dissipation design of the driver board,the main factors affecting the heat dissipation capability of the driver board are obtained.Simulation experiments show that changing the PCB structure and installing the heat sink for high-power devices can effectively reduce the junction temperature of the device.According to the proposed optimization method,the heat dissipation design of the driver board is optimized,and the simulation software is used to simulate the temperature conditions before and after optimization,and the effectiveness of the optimization scheme is verified by experiments.The simulation and experimental results show that the heat dissipation optimization scheme adopted in this paper reduces the junction temperature of the main power devices of the driver board,improves the temperature distribution of the driver board,and improves the reliability of the driver board.