Lightweight Design Of Cooling Plate In Case Based On Thermo-Mechanical Coupling Analysis

The high-density assembled electronic equipment in the modular case realizes the lightweight of the case,but also causes the problem of high heat concentration,which affects the reliability of the onboard electronic equipment.Therefore,in the structural design of the case,attention should be paid to the heat dissipation design,and the cooling plate of the case is an indirect heat exchanger.It is often used as the base of the equipment and is widely used in the case to take away the heat dissipated by the electronic devices.The lattice multi-function structure has excellent properties such as ultra-light,high strength,and many regular pores,which provides a new idea for the research of lightweight,high-load and heat-dissipating case cooling plates.In this paper,the cooling plate of the standard plug-in case is taken as the research object,the establishment and solution of the thermomechanical coupling model of the lightweight structure is taken as the research direction,and the lightweight design of the case cooling plate based on the thermomechanical coupling analysis is the final research goal.The bearing capacity,heat dissipation capacity and existing problems of the liquid cooling plate of the original solid material are analyzed.The lattice structure plate is used to replace the cooling plate of the solid material,and the calculation results of different thermomechanical coupling simulation methods and different grid types are compared.The optimization design of the lattice board is carried out under the condition of considering the load and heat dissipation,and the engineering design of the case structure is proposed.In view of the bearing capacity of the original solid liquid-cooled cold plate with flow channels,this paper considers the thermal and mechanical load boundary conditions in its working state.According to the working temperature and the cold plate acceleration requirements after the chassis is thermally balanced,the article performs mechanical and thermal performance simulation calculations on the original cold plate,and analyzes the existing load and heat dissipation problems.Finally,the article determines the design direction of the lightweight cold plate structure.In this paper,different simulation methods are used to study the heat dissipation performance of the lattice structure under heat load.For the heat dissipation performance of the cooling plate of the chassis,the article uses different types of units and different thermo-mechanical coupling methods to calculate the lattice structure,analyzes the differences between the sequential coupling and fully coupled algorithms,and discusses the respective adaptation scenarios of the beam element and solid element models.The heat transfer form of lattice structure is also discussed.By comparing the temperature field distribution and thermal stress of the model after calculation,the article determines the suitable simulation method for cooling plate.In order to reduce the weight of the cooling plate of the case,this paper uses a 3D lattice for structural design.By comparing the size parameters and layout patterns of different lattice cells,the correspondence between various variables and the mechanical properties of the structure is determined.Based on this,the article establishes an optimized model of lattice cooling plate,and performs finite element simulation calculation on the cooling plate under the given mechanical and thermal environment.The article analyzes the lightweight,heat dissipation and load-bearing capacity of the two cooling plates,and evaluates the cooling plate design.