The Research And Application Of IC Bonding And Inspection For TFT-LCD Module

The requirement of higher display quality from end users is promoting the development of display technology.Features of high resolution,high brightness,and high contrast of TFT-LCD are putting forward more and more rigorous requirement to the manufacture of TFT module.And the IC&FPC bonding is the most critical process in the TFT-LCD module.It will be a big challenge to ensure every product which is delivered to customer with good bonding quality.In this paper,the whole process of the thin film transistor liquid crystal display and the TFT LCD structure with the process characteristics are introduced.The process can be divided into TFT and Module process.So you can have a more comprehensive understanding of the thin film transistor liquid crystal display(TFT LCD)process.The detail introduction about the IC bonding process of module process which including ACF introduction and parameter verification and also the technical criterion of the bonding process are introduced.Also you can have a clearly understanding of the properties of the Anisotropic Conductive Film(ACF)such as how to form the conducting particle and the how to judge the failure or good of the bonding process.The mothed of manually using Microscope by human to check product quality could not meet the high quality requirement nowadays.So it is extremely necessary to import a type of automatic inspection method for IC bonding quality inspection to make sure all the products that shipped to customer have a good performance of bonding quality.The way of using charge coupled device(CCD)sensor for automatic inspection has been studeied in AUO with vendor.We have made a series of experiments indluding inspection methods and parameter fine tune and succefully the new inspection way of conductive particles has been used in production and the productivity and quality control are greatly improved.Also the auto optical way of inspection has its drawbacks and we need to have more research for the inspection method to avoid leakage and overkill of the product.