Thermal Management Research Of Three-Dimensional Integrated Circuit With Micro-Channels

Three-dimensional integrated circuits have become a research hotspot in recent years due to the advantages of small interconnect delay,heterogeneous integration,high integration,and improved data transmission bandwidth.However,due to its high power density and high chip packaging density,the traditional heat dissipation method of air cooling is too long to meet the heat dissipation requirements of three-dimensional integrated circuits,making 3D integrated circuits face serious thermal management problems.Effective new thermal management methods have become an urgent problem for 3D ICs.In this thesis,micro-channels liquid cooling thermal management is studied for 3D ICs.Based on the research of micro-channels liquid cooling at home and abroad,the basic performance parameters of the micro-channels are determined,and the working principle of the micro-channels liquid cooling in the three-dimensional integrated circuit is explored.Firstly,a three-dimensional integrated circuit model of a rectangular micro-channel was established in COMSOL,and the influence of the micro-channel's structural parameters and different constraints on the heat dissipation capacity of the micro-channel was studied.At a power density of 250 W/cm~2,the flow rate was measured.Under the constraint of pressure drop and pump power consumption,the optimal micro-channel heatsink structure is obtained when the number of micro-channels is 130 and the scaling factors?and?are taken as the minimum 0.2 and the maximum 0.6,respectively.The maximum temperature is 320.37K.Secondly,in order to realize the trade-off between Electrical Through-Silicon-Via(TSV)and micro-channels in terms of wiring space and chip thickness during the process of electrical signal transmission,and at the same time meeting the thermal and electrical performance requirements of 3D IC,Electrical TSV and micro-channels liquid cooling are designed in a consistent manner.The results show that when the TSV diameter is taken as a small value and the TSV aspect ratio is larger,it not only satisfies the heat dissipation capacity of the micro-channel,but also the electrical properties of the TSV meet the requirements.Finally,a thermal resistance model was established for 3D ICs based on micro-channel heat dissipation.In order to fully verify the correctness of the model,the micro-channel structure,flow,and power density of the chip device layer were simulated and compared.The simulation results of the resistance model and the COMSOL simulation result show that the maximum error is 1.2%,which verifies the correctness of the model.The thermal resistance model can effectively reduce the design cost of micro-channels and improve design efficiency.