| With the development and perfection of Computer Aided Education technology in engineering,simulation is playing a more prominent role.Meanwhile,as the extent of integration of electronic packaging is significantly increasing,thermal design of electronic components has become a major key technology to ensure product performance and reliability.However,the temperature profile of electronic elements in work condition and the optimization of thermal design cannot be completely solved by experimental verification,while draining a large number of resources.To this end,the CAE simulation technology is applied to the thermal simulation of electronic products.The temperature distribution is first obtained and the thermal design of electronic components is optimized.Therefore,the performance of electronic products and their reliability can be enhanced.The study is carry out the thermal simulation and to reach good heat radiation effect of the transistor,the main heating device of the Hall Effect current sensor.In a comprehensive analysis of ANSYS software and application development home and abroad,the thermal simulation based on ANSYS is proposed and reacted with specific products-Hall Effect current sensor combination.Through this research,the structure design and verification of transistor device,along with the distribution of temperature of the product,can be achieved. |