Thermal Design And Analysis For 55 Inch LCD Modul

Along with the consumer to the television's esthetic demand is higher and higher,besides to the display exquisite degree itself request,also extends to to the display brightness high request.At present,the photoelectric conversion rate of LED lamp is only 30%,and a large amount of power consumption is converted into heat,which increases the system temperature.As a result,the current method becomes more and more laborious in heat dissipation,which results in high temperature and affects the luminous intensity and color purity of LED lamp.At the present stage,the research on heat dissipation of the backlight industry of domestic manufacturers is relatively weak.Only a few international large factories will consider heat dissipation design in the early stage of development,and they are not open to the public as development secrets.In this thesis,we research project 55 inch LCD TV backlight module(55 art3)as the research object,based on the theory of heat transfer,fluid mechanics,according to a backlight module,light source and the basic principle of fever,using software Flotherm LCD TV backlight module internal air flow field and temperature field simulation model,the finite element simulation analysis.The testing experiment of the cooling system was completed with the object of backlight module as the research object.The actual test values obtained were compared with the analysis values of the software,and the experimental simulation parameters were adjusted and improved to improve the accuracy of the simulation test results.The influence of aluminum radiator's material and width on backlight module's cooling system is analyzed.At the same time,the simulation integration of the system test was completed according to the optimization scheme,the physical verification test was completed,and the reliability and accuracy of the system optimization results were improved.Through the study of this model,we can find that CSP packaging has lower thermal resistance than traditional packaging,and is more suitable for backlight module.Under the same power,the heat dissipation capacity of 7020 LED with lower thermal resistance is better than that of 4014 LED.With the same light source,the heat dissipation capacity of extruded 6063 aluminum heat dissipation bar isobviously better than that of pressed 5052 aluminum heat dissipation bar.The backlight module cooling system is designed and optimized through the Command Center optimization design module.When the width of the cooling aluminum bar is70 mm,the overall cooling system has the highest cost performance.