Research On SIP Technology Of Digital Steering Gear Control Circuit For Missiles

SIP(System in a package)is to two or more large scale integrated circuit chips and other naked micro components(including chip components)electrical connection in the same piece of Shared high-density interconnect substrate,and packaging in the same shell made of high-density microelectronic component with a component or System functions.In order to meet the requirements of increasing system functions,reducing volume and weight of aerospace products,SIP technology was studied based on the control circuit of missile digital steering gear.This paper uses SIP technology to design a miniaturized digital steering gear control circuit module for SIP missile.This module uses DSP+CPLD as the main control chip to complete the servo control of the steering gear.On this basis,the principle design of hardware circuit is completed.In order to realize the control circuit module of SIP missile digital steering gear,it is necessary to have the guarantee of relevant technology.In this paper,LTCC substrate process characteristics are studied to determine miniaturized layout design,packaging methods,welding methods,etc.Through the research of chip pasting technology,the scheme of naked chip pasting suitable for this module is determined.By studying plasma cleaning technology,the gas and cleaning parameters of plasma cleaning process suitable for this module were determined.By studying the principle of lead bonding,selection of bonding mode and chip shear force test,the chip lead bonding scheme suitable for this module was determined.By studying the mechanism of sealing welding,it is determined to adopt the method of parallel sealing welding for sealing,and the final sealing shell meets the requirements of air tightness.Through the research of this paper,various indexes of the control circuit module of SIP missile digital steering gear meet the technical requirements and achieve the goal of reducing the external size by 4%.The development of this paper has a new understanding of SIP technology design method and process method,which will provide help for the later SIP design by summarizing.