| Interconnect formation is critical for the assembly and integration of nanocomponents for nanoelectronics and nanosystems related applications. Extensive research on packaging and assembly of functional circuits and/or prototype devices using key nanomaterials, such as nanoparticles, nanowires and carbon nanotubes, have been explored in previous studies. Several techniques have been employed to make electrical contacts between nanostructures such as electron beam lithography, electron and ion beam deposition, atomic diffusion, etc, which have several drawbacks including complexity, cost, and sample contamination. In this research electroplating method using nanoporous templates was used to fabricate low melting point solder materials (110°C-157°C) such as indium and its alloys onto single and multi-segmented nanowires. A new silver etchant solution, replacing previously widely used acid solutions, was used to etch silver in the fabrication process of nanowires using the anodized aluminum oxide (AAO) templates, thereby protecting active metal nanowires including solders. Thermal reflow properties of nanosolders on nanowires were studied, and these low-melting solders were explored to integrate metallic and conducting polymer nanowires. This study focuses on the fabrication of such novel structures by using these interconnect materials as candidates for future nanoscale assembly and packaging applications in nanoelectronics. Nanosoldering technique has also been exploited to integrate metallic and conducting polymer nanowires, which have great potential for novel electrical and sensing properties. Utilizing this simple approach we can assemble these nanostructures into devices with ohmic contacts with minimum contact resistance. Possible applications of these nanosolder materials and nanosoldering techniques include the assembly and integration of medical devices, chemical gas sensors and photovoltaic cells.;Keywords. Nanoelectronics, Nanosoldering, Nanowires, Low melting solders, Nanopackaging... |
