Research and application of a thermal management device (CoolCap(TM)) for electronic assemblies

Transformation to lead-free processing involves a number of challenges that electronics manufacturers face. The two main concerns faced are related to the alternative lead-free solder alloys and the effect of higher temperatures on heat-sensitive components and the PCB itself.; This thesis concentrates on the issues related to the heat-sensitive components in lead-free assembly processes. In this thesis, different challenges related to heat-sensitive components in lead-free assembly are discussed in detail. An effort is made to address the challenges in the form of a novel thermal management device called "CoolCap".; Working of CoolCaps involves two different cooling phenomena known as active and passive cooling. Experiments are performed to understand the role of each of these phenomena. Challenges of processing heat-sensitive components, along with the appropriate CoolCap design, are discussed via a case study. The research is divided into four parts: challenges in the process, process details, CoolCap configurations used, and results. To understand the operational envelope, particularly for the pick-and-place operation of CoolCaps, different materials (used to construct the CoolCaps) are studied.; This technology is shown to facilitate the assembly of heat-sensitive components in lead-free processing. Results indicate that, with the use of these CoolCaps, the thermally sensitive components can be protected from the harsh (high-temperature) lead-free assembly and reflow environments.; The future scope and recommendations that have been identified based on the in-house and ongoing beta testing are also summarized.