| The performance of smart structures depends on the dynamic electromechanical behaviour of piezoelectric sensors/actuators and the bonding condition along the interface, which connects the sensor/actuator and the host structures. This thesis documents a theoretical study of the influence of material parameters of the bonding layer on the coupled electromechanical characteristics of piezoelectric sensors/actuators, which are subjected to high frequency mechanical loads or electric loads. A one dimensional sensor/actuator model with a bonding layer, which undergoes a shear deformation, is proposed. Analytical solutions based on the integral equation method are provided. Detailed numerical simulation is conducted to evaluate the effect of the bonding layer under different loading frequencies. The results indicate that, the properties of the bonding layer, the loading frequency, the material combination and the geometry of the sensor/actuator have significant effects on the load transfer between the sensor/actuator and the host medium. |
