Thermal and thermomechanical behavior of multi-material molded modules with embedded electronic components for biologically-inspired and multi-functional structures

A multi-stage molding process has been implemented to affordably mass-produce multi-material modules with embedded electronic components for biologically-inspired and multi-functional structures.;To gain insight into the thermal and thermomechanical behavior of these modules, experiments were designed and conducted to determine three critical design characteristics of the modules: (a) the steady-state thermal conductivity across the multi-material interface in a module, (b) the transient thermal response at the core of the multi-material module at elevated temperatures, and (c) the thermomechanical strains that develop around the embedded electronic components in the multi-material module during in-mold processing and operation of the components. Based on these experiments, analytical and numerical models are developed for predicting the thermal and thermomechanical behavior of multi-material modules with embedded components that provide a foundation for designing these modules for biologically-inspired and multi-functional structures. (Abstract shortened by UMI.)...