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Correction of transient solid-embedded thermocouple data with application to inverse heat conduction

Posted on:2006-11-02Degree:M.SType:Thesis
University:Mississippi State UniversityCandidate:Johnson, August Nathan FletcherFull Text:PDF
GTID:2450390008975689Subject:Engineering
Abstract/Summary:
The current research investigates the use of solid-embedded thermocouples for determining accurate transient temperature measurements within a solid medium, with emphasis on measurements intended for use in inverse heat conduction problems. Metal casting experiments have been conducted to collect internal mold temperatures to be used, through inverse conduction methods, to estimate the heat exchange between a casting and mold. Inverse conduction methods require accurate temperature measurements for valid boundary estimates. Therefore, various sources of thermocouple measurement uncertainty are examined and some suggestions for uncertainty reduction are presented. Thermocouple installation induced bias uncertainties in experimental temperature data are dynamically corrected through the development and implementation of an embedded thermocouple correction (ETC) transfer function. Comparisons of experimental data to dynamically adjusted data, as well as the inverse conduction estimates for heat flux from each data set, are presented and discussed.
Keywords/Search Tags:Data, Inverse, Thermocouple, Heat, Conduction
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