Thermal/fluid characteristics of three-dimensional woven mesh structures as heat exchanger surfaces

The present work demonstrates the fabrication methodology and thermal-fluid performance of a bonded, woven-wire matrix that is used as a heat exchanger core, configured in such a way that thermal performance is maximized while coolant pressure drop is maintained at low levels. Pressure drop and heat transfer measurements are reported for a fabricated test sample. The study has practical and theoretical interest since it relates to heat transfer problems faced now by the electronic industry.; It is found that (1) Woven 3_D wire meshes are very difficult to be built; (2) Woven 3_D wire meshes are very expensive compared with plane-weave laminated screens; (3) Woven 3_D wire meshes have a small advantage in heat transfer compared with plane-weave laminated screens; (4) Woven 3_D wire meshes show the same pressure drop characteristics as staggered plane-weave laminated screens; (5) Woven 3_D wire meshes don't perform as well as packed beds of spherical particles.