Application of numerical heat transfer analysis for temperature prediction in space vehicles

Thermal response of the space shuttle orbiter side hatch photography system is investigated using finite difference thermal analysis methods to demonstrate the feasibility of system installation, support system thermal design, and predict temperatures of the system for specific flight environment. A thermal math model (TMM) and a geometrical math model (GMM) were constructed for the analysis. The system improved numerical differencing analyzer (SINDA), and the thermal radiation analysis system (TRASYS) programs were used for the analysis. The data obtained indicate that the maximum temperature of all components of the system are within their allowable temperature limits and the system will be at a safe level thermally for the anticipated flight environment.