Study On Corrosion Inhibitor For Improving Printed Circuit Board Quality

A printed circuit board(PCB)is a carrier that connects all components in electronic products,and is a key component to ensure the processing and transmission of electronic signals.With the rapid development of information technology and industry,the society has increasingly demanded the functions and quality of electronic products,and the application fields of electronic products have been continuously expanded.The quality and performance of printed circuit boards(PCBs)must be continuously upgraded.The quality and performance of the PCB depends on the manufacturing process of the fine circuit.Therefore,this topic will focus on the research of the manufacturing technology of high-quality fine circuits.Based on a series of problems such as severe line side corrosion in the subtractive method,semi-additive method has side corrosion at the bottom of the line,the bonding force between the base material and the line is reduction,and high production cost of the full addition method,this topic studies the corrosion inhibitors against electrolytic The effect of etching process PCB fine circuit quality.Firstly,select metal copper corrosion inhibitors that have potential to improve the performance of electrolytically etched fine lines.Secondly,using optimized experimental techniques,the effects of slow release agents on the quality of fine lines in electrolytic etching processes were investigated.Finally,quantum chemical calculations and molecular dynamics simulations are used to explore the principle of corrosion inhibitors to suppress side corrosion of fine lines,which lays a good foundation for large-scale industrial application of electrolytic etching process to produce high-quality,high-performance PCB fine lines.The specific experimental content and related conclusions are as follows:1?Screening of corrosion inhibitors(1)Screen out potential corrosion inhibitors based on isoelectric point and corrosion inhibition performance:Pyrimidines include Sulfadiazine(SD),2-mercaptopyrimidine(2-MPM),2,4,6-triaminopyrimidine(TAP),2-mercapto-4,6-dimethylpyrimidine(MDP)and 2-Aminopyrimidine(2-AP);Pyridines include 2-mercaptopyridine(2-MP),chlorohexadecylpyridine(CPC)and bromohexadecylpyridine(CPB);Amino acids include L-Asparagine(LAA),DL-methionine(DLM);And indazoles include 4-fluoro-1H-indazole(FHI),4-bromo-1H-indazole(BHI),5-aminoindazole(AD);(2)Use single factor experiment to determine the research object:Sulfadiazine(SD),2-mercaptopyrimidine(2-MPM),2,4,6-triaminopyrimidine(TAP),chlorohexa decylpyridine(CPC)and bromohexadecylpyridine(CPB);2?The effect of corrosion inhibitor on the quality of electrolytically etched fine linesTaking the fine line etching factor as the optimization target.The corrosion inhibitor concentration,Cu Cl₂·2H₂O concentration,HCl concentration,and current density as the optimization objects,optimize the experimental conditions of 5 potential corrosion inhibitors.Among them,sulfadiazine,2,4,6-triaminopyrimidine and 2-mercaptopyrimidine were optimized with improved simplex;chlorohexadecylpyridine and bromohexadecylpyridine were optimized using orthogonal experiment.Under the optimized experimental conditions,the five corrosion inhibitors significantly improved the quality of PCB fine lines.The sulfadiazine corrosion inhibitor has the most significant improvement in the quality of PCB fine lines.3?Exploring the mechanism of corrosion inhibitor to improve the quality of fine lines(1)The calculated frontal orbital energy gap(?E)and molecular dipole moment indicate:The ability of the corrosion inhibitor to form a chemical bond with the metal(TAP<2-MPM<CPB<CPC<SD)aren't consistent with the adsorption capacity of the corrosion inhibitor on the copper surface obtained by molecular dynamic simulation(CPB>CPC>SD>TAP>2-MPM).But it is consistent with the experimental results of corrosion inhibitors on the improvement of fine line quality.The result shows:In the electrolytic etching system,the degree of improvement of the fine line quality by the corrosion inhibitor is positively related to the ability of the corrosion inhibitor and the metal to form a chemical bond.However,the relationship with the adsorption capacity of the corrosion inhibitor on the metal surface is uncertain;(2)Comsol multiphysics simulation calculations show that:There is a significant difference in the amount of corrosion inhibitor adsorbed on the sidewall and front of the fine circuit.This difference is the fundamental reason why corrosion inhibitors improve the quality of fine lines.