Research On Through-mask Electrochemical Micromaching With Moving Cathode Of Fabrication Of Metal Micro-grooves

Through-Mask Electrochemical micromachining(TMEMM)has been widely used in the machining of micro-structures because of its high processing efficiency,no electrode loss and no residual stress.In order to solve the problems of poor structure uniformity in the process of TMEMM,this paper proposed a technology that TMEMM with moving cathode on the basis of conventional TMEMM,and made a micro-groove array based on the Through-Mask Electrochemical micromachining with moving cathode technology.Finally,the microgroove array with high uniformity was successfully fabricated on the surface of 304 stainless steel.The research content of this paper promotes the application and development of TMEMM technology.The work can be divided into the following aspects:(1)Based on Faraday's law of ECM,the TMEMM process was analyzed,and the relationship between ECM depth and current density was obtained.Based on the conventional Through-Mask Electrochemical micromachining,TMEMM with a moving cathode technology was proposed.The reciprocating movement of the cathode was used to improve the current distribution in the machining process and reduce the influence of current edge effect,so as to improve the uniformity of etching depth of the structure.(2)Based on the current distribution model of ECM,the numerical analysis of TMEMM with moving cathode was carried out by using the COMSOL finite element analysis software.The influence of different machining parameters on the anodic micro-groove etching profile was studied and the inhomogeneity of the etching depth of the structure was calculated.The simulation results show that: Electrochemical processing with moving cathode can improve the etching depth uniformity of micro-groove array structure.With the increase of the distance between anode and cathode,the unevenness of micro-groove array decreases first and then increases.With the increase of cathode width,the depth inhomogeneity of micro-grooves increases gradually.When the velocity of the cathode increases,the inhomogeneity of micro-groove etching depth decreases gradually.(3)Experiments were carried out to study the influence of different machining parameters on the uniformity of etching depth of micro-groove structure.The PLC movement control module is programmed and the electrolyte flow mode is optimized.Then,the electrochemical machining experiment is carried out and the experimental results are compared with the simulation results.The results show that: The simulation results show the same trend as the experimental results,and the etching depth inhomogeneity between the micro-groove structures is reduced by 30.3% through the TMEMM with moving cathode.(4)In order to solve the problem of deep etching at the edge of a single micro-groove,the shape of the cathode was optimized based on the TMEMM with moving cathodel technology.Through simulation calculation and TMEMM experiment,the geometric parameters of the cathode shape were optimized,and the microgroove array with good uniformity was successfully produced,the unevenness of a single microgroove structure was reduced by 56.9%.