Study Of Resin Material For High Frequency And High Speed Copper Clad Laminate

The rapid development of 5G communications has led to the explosive growth of the copper clad laminate(CCL)industry.According to the authoritative department forecast,the market demand for CCL will reach 110 billion yuan in 2025.However,in the production process of CCL,there will be problems such as insufficient curing of resin matrix,low yield and substrate delamination,and resin agglomeration,which will affect the quality of products.In view of this,this paper hopes to solve or improve the above problems by studying the modification of CCL substrate resin materials.Firstly,the curing kinetics of poly(phenylene oxide)(PPO)/polybutadiene(PB)/bismaleimide(BMI)multi-component resin system were studied.The kinetics of the multi-component system was studied by differential scanning calorimetry,and the curing temperature curves of resin system at different heating rates were obtained and analyzed.The optimal curing temperature of the multi-component resin system was obtained by linear fitting as 132°C+178°C+212°C.Secondly,the reaction conditions of the three resins with the modifier were determined by the reaction of PPO,PB and BMI with the modifier.The results showed that the reaction rate between BMI and modifier was faster than with other two PPO and PB resins,So PPO and PB resin were selected to prepare pre-crosslinked resin system,and the viscosity of pre-crosslinked resin glue was monitored within a certain time.The viscosity of pre-crosslinked resin glue is moderate,which was suitable for processing and was clear and transparent at room temperature.The resin solution can be stored for 2-4 weeks.The pre-crosslinked system was prepared into CCL plates and tested.Compared with the resin solution without pre-crosslinking treatment,the phase separation of the CCL plate as prepared from the pre-crosslinked resin was significantly reduced,and the glass transition temperature(T_g)of the resin slightly decreased.Finally,PB resin was modified in order to increase its T_g,thereby increasing T_g of CCL.Modification of PB resin by The Heck reaction was used to introduce the tolyl,naphthyl and diphenyl(termed as T,N and D,respectively).The glass transition temperature of the modified PB resins was significantly improved.The grafting degree of the product was calculated by UV-vis absorption calibration method.When the mole ratio of C:D=1:1.2 was selected(C represents the molar number of C=C group in PB),the modified product C-D 1.2 is obtained.The modified PB was mixed with PPO and BMI resin and then treated with modifier.Compared with the unmodified PB/PPO/BMI resin treated with modifier,the T_g of the former was increased by about 13°C,which proved that the T_g of CCL plate can be improved by modifying PB.