Research On Metamaterials And Key Tecnology Of RF Front-end Based On SISL Platform

Since 5G wireless communication era has arrived,low cost,high performance,and miniaturization circuits have become the basic requirements of new wireless communication equipment.Therefore,each part of the module must also have high performance and small size.As the electromagnetic environment becomes more complicated,microwave devices also put forward higher requirements on the cost,weight,integration,and other performance of microwave devices.Substrate Integrated Suspended Line(SISL)is a new type of transmission line which meets the above needs,and has the characteristics of low loss,compact size and self-packaging.Under this background,this thesis is focus on the combination of SISL and wireless communication system module.First,the basic theory of transmission line and metamaterial is demonstrated.The resonant characteristics and influence of the structure size on the resonant frequency of the resonant metamaterial element are analyzed.The problem of S parameter inversion algorithm is discussed.Then,a three-dimensional “I” shape metamaterial element structure with high permittivity is proposed.The electromagnetic resonance characteristics of this element are studied and it is proved that the resonant element has high permittivity under the electric resonance response,and the equivalent permittivity of the resonant element reaches 220 at 9.5GHz.Based on the flexibility of SISL circuit design,“I” shape threedimensional metamaterial element is periodically arranged on the dielectric plate.By using the high equivalent permittivity property of metamaterial at the left side of resonant frequency,a miniaturized low-pass filter is proposed.The cut-off frequency is 3GHz,and the filter size is reduced to 57.2% compared with the original size.The proposed metamaterial with high permittivity provides a new reference direction for the miniaturization of RF microwave circuits.At last,this thesis utilizes the characteristics of low loss and easy integration of the SISL platform to design a K-band broadband hybrid integrated power amplifier based on active chips.In order to solve the problems of testing and integrated interconnection in SISL,the K-band broadband transition from SISL to GCPW(Grounded Coplanar Waveguide)is designed at the same time.By comparing the experimental results of the SISL PA module with the evaluation board integration from the PA manufacture,SISL have advantages in terms of low loss,excellent electromagnetic shielding,high feasibility and self-packaging.In addition,the proposed SISL-to-GCPW transition can accelerate the development of SISL circuit in K-band.