Interfacial Strength Analysis Of Multilayer Material Fabricated By 3D Printing

3D printing technology is widely used in the field of electronic engineering.For example,UV resin is used as the packaging material to selectively print three-dimensional packaging entities with protective properties on the surface of the circuit board.Due to the difference in material properties between the resin and the substrate,the bonding strength directly affects the service life of electronic components.Therefore,it is of great practical significance to analyze and improve the interface bonding performance between the UV resin and the substrate.In this paper,the direct-write 3D printing(DIW)combined aluminum alloy base resin composite layered material is used as the research object,and the interface bonding strength between different materials is numerically simulated and experimentally studied.(1)The micro-groove structure is prepared on the surface of aluminum alloy by nanosecond laser,and the morphology and size of the micro-groove structure are adjusted by changing the laser parameters,so that the surface of the substrate has a certain rough structure and good super-hydrophilic properties.It produces a mechanical bonding interface,so that the resin material can be better spread on the surface of the metal substrate.The laser parameters for the optimal wettability are laser power 12 W,scanning speed 200mm/s,and filling gap 0.01 mm.(2)Quantitative and qualitative measurement and analysis of the bonding strength between the aluminum alloy base resin composite layered material interface by the digital display method and the cross-cut method.Underyithe same 3D printing process parameters,the surface interface bonding strength of aluminum alloy surface groove structure parts is nearly 20% higher than that of non-woven construction parts.It has been successfully verified that the surface of the micro-groove structure with good hydrophilicity can increase the bonding force between layers.(3)In order to further explore the effect of surface microstructure on the interface bonding force,a peel test simulation model was established through ABAQUS finite element simulation software,and the material properties of the resin and the matrix were considered separately,and the cohesion model was used to characterize the bond between the resin and the aluminum alloy substrate.Strength,analyze the influence of different surface microstructures on the bonding force between interfaces,and provide an important theoretical basis for improving the bonding strength of the interface.