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Synthesis And Curing Properties Of Fluorinated Curing Agents

Posted on:2022-04-04Degree:MasterType:Thesis
Country:ChinaCandidate:J X YangFull Text:PDF
GTID:2481306575482914Subject:Materials engineering
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Fluorinated epoxy resin has always been studied widely as a special thermosetting resin with excellent performance,but curing agent is an important component of fluorinated epoxy resin.A fluorinated amine curing agent is obtained by introducing fluorine into the diamine structure in this paper.The curing kinetics of the fluorinated curing agent is studied by the non-isothermal DSC.Bisphenol a epoxy resin(HBPA)was blended with FDAM to prepare fluorinated epoxy resin and studied different curing properties by DMA,XPS,TG and other testing method.The main jobs are as follows:Tetrafluoroterephthalic acid and 1,6-hexamethylenediamine as raw material was used to obtain tetrafluoroterephthalamide di-n-hexylamine(FDAM)by DCC/DMAP catalytic method.FDAM was synthesized by 1H NMR,FT-IR and GPC.HBPA/FDAM as the epoxy resin research system and test the curing reaction behavior.The Kissinger modus and FWO modus are used to obtain 62.56 KJ/mol and 72.52 KJ/mol(average value).Compared with the n-level kinetic simulation results,the reaction rate expression of the autocatalytic model is more suitable for the HBPA/FDAM system1,8-menthanediamine as co-curing agent,HBPA and diluent(XY-207)were blended to prepare different FDAM content of fluorinated epoxy resin samples.DSC and IR show that the epoxy resin system is fully cured and has good compatibility.DMA have found that Tg of the fluorinated epoxy resin system increases and the crosslink density decreases with the increase of FDAM.The mechanical strength of epoxy resin will decrease because of added FDAM and the minimum bending strength is 35 Mpa.The TGA results showed the T5%range from 287.6?to 252.1?with the increase of FDAM,while Char at 500?increased from 6.90%to 10.66%.XPS show that the surface of fluorinated epoxy resin contains a lot of F elements.Surface F max content and water contact angle is 7.03%and96.3°.The lowest dielectric constant and dielectric loss are 3.35 and 0.025 respectively.Figure 47;Table 14;Reference 90...
Keywords/Search Tags:Fluorinated curing agent, Fluorinated epoxy resin, Curing reaction kinetics, Tetrafluoroterephthalic acid
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