Experimental Study On Ultra-precision Cutting Of Monocrystalline Silicon Assisted By Laser Heating

As an excellent infrared optical material,monocrystalline silicon was widely used in integrated circuits,infrared optical systems and other fields.Due to the brittle nature of monocrystalline silicon materials,monocrystalline silicon was prone to brittle fracture during conventional turning,resulting in processed surfaces.Surface damage and other issues.Laser heating assisted turning was an effective method to improve the turning performance of difficult materials,has been gradually applied in carbide,ceramics and other difficult materials turning,with the effect of increasing tool life and improving the surface quality of workpieces.The research work of this paper was based on the above background.Aiming at the monocrystalline silicon material,a laser heating assisted monocrystalline silicon ultra-precision turning technology was proposed,focus on monocrystalline silicon laser heating temperature and thermal stress simulation,laser heating assisted turning temperature test,laser heating assisted monocrystalline silicon ultra-precision turning test and so on.The main research contents include.(1)Monocrystalline silicon laser heating temperature and thermal stress simulation.A model of the temperature field of laser-heated monocrystalline silicon was established,and the relationship between the temperature and heat transfer depth of monocrystalline silicon was obtained by simulating and analyzing the influence of laser power and spindle speed on the distribution of monocrystalline silicon surface and internal temperature field.Finally,the effect of laser power and spindle speed on the thermal stress on the surface of monocrystalline silicon is analyzed.(2)Laser heating assisted turning test platform and temperature detection.In order to verify the correctness of the laser heating monocrystalline silicon temperature field simulation model,a laser heating assisted turning test system was constructed,and a high-speed infrared thermometer was used to conduct a temperature measurement test on the monocrystalline silicon workpiece to analyze different laser power,spindle speed,feed speed,etc.The temperature change law of the heating area on the surface of the workpiece under the conditions,comparative analysis the relationship between the simulated value of the temperature field and the actual measured value.The test results show that the actual measured temperature value was basically consistent with the change trend of the temperature field simulation value.(3)Experimental research on laser heating assisted ultra-precision turning of monocrystalline silicon.Comparative analysis of conventional turning and laser heating assisted monocrystalline silicon ultra-precision turning process cutting force,cutting patterns,tool wear,surface damage and roughness and other differences.Study different laser power,spindle speed,back-cutting,and feed the influence of speed and other conditions on cutting force,tool wear,monocrystalline silicon surface damage and roughness,etc.Finally,the preferred processing parameters of laser heating-assisted single crystal silicon ultra-precision turning are obtained.