Preparation Of SiO₂ Microcantilever And Mechanical Simulation Of Its Structure

Micro-Electro-Mechanical Systems(MEMS)is a set of micro machinery,micro actuator,signal processor,and control,interface,communication and power supply is equal to one of the batch production of automation and intelligent microsystem.Its main characteristic is miniaturization,and the critical dimensions of the system are usually in the submicron and submillimeter range.Therefore,it is a research field that needs to be considered in terms of multidisciplinary intersections,multifield coupling,and various micro and fine interactions(such as van der Waals forces,Casimir forces,etc.).With the development of industry and society,MEMS devices have been more and more widely used,and the research on MEMS devices has widely concerned and further developed.As one of the common microstructures in MEMS,microcantilever beam has been widely used in many sensing and detection fields because of its small size,low power consumption,high sensitivity and fast response speed.In this paper,the preparation technology exploration of SiO2 microcantilever beam,the series of beam structure mechanical simulation in the release process and the substrate selection of the microcantilever structure to be made in the future are studied.Firstly,the crystal structure of monocrystalline silicon and the choice of wet etchant are briefly explained,followed by a brief introduction of the equipment needed for the preparation of SiO2 microcantilever beam,self-designed devices,based on the laboratory existing conditions was prepared SiO2 microcantilever,the related technological process and the specific process parameter,and a full analysis of the preparation results.When SiO2 microcantilever was prepared by KOH wet etching,incomplete or over-complete undercutting was found at the bottom of the microcantilever structure with the etching mask edge at 45° from(100)silicon wafer’s main reference surface.With the help of COMSOL Multiphysics simulation software,modal analysis and static analysis are carried out on the three-dimensional model of microcantilever structure which has never been completely undercut to completely undercut.The static working mode of the microcantilever and the stress concentration under the influence of residual stress are simulated by different loading forms.For the SiO2 microcantilever structure to be produced by the research group in the future,COMSOL Multiphysics simulation software is used to simulate its static and dynamic performance.The influence of the material,shape and connection mode of the substrate on its static performance was studied.The influence of substrate material and micro mass on its dynamic performance has also been studied.It provides a reference basis for choosing different substrates when different measurement needs are met.Microcantilever plays an extremely important role in modern detection and analysis.Through the research work of this subject,SiO2 microcantilever has been successfully prepared,and a series of simulation analysis has been carried out on observed structure and the structure to be prepared,which provides a corresponding reference for the follow-up work of the research group.